RF isolator with differential input/output
First Claim
Patent Images
1. A system comprising:
- a first chip containing functional circuitry;
a second chip containing functional circuitry; and
at least one RF isolation link interconnecting the first and the second chip, the RF isolation link providing voltage isolation between the first chip and the second chip and limiting common mode signals passing through the at least one RF isolation link, wherein the at least one RF isolation link further comprises;
a first transformer on the first chip; and
a second center tap transformer on the second chip.
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Abstract
A system for providing voltage isolation includes the first and second chips, each containing functional circuitry. The chips are interconnected via at least one RF isolation link that provides voltage isolation between the first chip and the second chip and limits common mode signals therebetween.
162 Citations
21 Claims
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1. A system comprising:
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a first chip containing functional circuitry; a second chip containing functional circuitry; and at least one RF isolation link interconnecting the first and the second chip, the RF isolation link providing voltage isolation between the first chip and the second chip and limiting common mode signals passing through the at least one RF isolation link, wherein the at least one RF isolation link further comprises; a first transformer on the first chip; and a second center tap transformer on the second chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An apparatus comprising:
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a chip containing functional circuitry; and a portion of at least one RF isolation link interconnecting the chip with an external chip, the RF isolation link providing voltage isolation between the chip and the external chip and limiting common mode signals passing through the portion of at least one RF isolation links, wherein the portion of the at least one RF isolation link further comprises; an integrated center tap transformer for electromagnetically coupling a transmitter output onto an external link to a transformer on the external chip. - View Dependent Claims (15, 16, 17)
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18. A circuit package, comprising:
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a first die containing functional circuitry; a second die containing functional circuitry; and at least one RF isolation link interconnecting the first and the second die, the RF isolation link providing voltage isolation and limiting common mode signals between the first die and the second die, wherein the RF isolation link further comprises; a first transformer on the first die; and a second center-tap transformer on the second die. - View Dependent Claims (19, 20, 21)
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Specification