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Multiple wavelength sensor interconnect

  • US 7,377,794 B2
  • Filed: 03/01/2006
  • Issued: 05/27/2008
  • Est. Priority Date: 03/01/2005
  • Status: Active Grant
First Claim
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1. A sensor interconnect assembly comprising:

  • a circuit substrate including an elongate portion;

    an emitter portion of the substrate adapted to mount a plurality of emitters;

    a detector portion of the substrate adapted to mount a detector;

    a cable portion of the substrate adapted to connect a sensor cable;

    a first plurality of conductors disposed on the substrate electrically interconnecting the emitter portion and the cable portion at least partially disposed along the elongate portion of the substrate;

    a second plurality of conductors disposed on the substrate electrically interconnecting the detector portion and the cable portion at least partially disposed alone the elongate portion of the substrate; and

    a decoupling portion of the substrate disposed between the cable portion and the elongate portion substantially mechanically decoupling stress associated with the cable portion from one or more of the first and second pluralities of conductors along the elongate portion of the substrate.

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