Pad designs and structures for a versatile materials processing apparatus

• US 7,378,004 B2
• Filed: 05/23/2002
• Issued: 05/27/2008
• Est. Priority Date: 02/23/2000
• Status: Expired due to Fees

• Current Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Original Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Inventors: Talieh, Homayoun, Basol, Bulent, Uzoh, Cyprian
• Primary Examiner(s): Tsang-Foster; Susy
• Assistant Examiner(s): Leader; William T.
• Application Number:
  US10/152,793
• Publication Number:
  US 20020130034A1
• Time in Patent Office: 2,196 Days
• Field of Search: 204/279, 204/224.R, 204/224.M, 204/217, 451/66, 205/662
• US Class Current: 204/212
• CPC Class Codes: B23H 5/08 Electrolytic grinding
• CPC Class Codes: B24B 37/26 characterised by the shape of the lapping pad surface, e.g. grooved
• CPC Class Codes: C25D 17/001 Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
• CPC Class Codes: C25D 17/14 for pad-plating

Abstract

An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface of a predetermined shape and a bottom surface. The rigid member contains a plurality of channels, each forming a passage from the top surface to the bottom surface, and each allowing the electrolyte and electric field flow therethrough. A pad is attached to the rigid member via a fastener. The pad also allows for electrolyte and electric field flow therethrough to the substrate.

Claims

1. A pad structure for use in an apparatus for depositing material on, or removing material from, a substrate, the pad structure comprising:

a substantially circular pad material having a top surface, a bottom surface and a defined thickness;

means for communicating electrolyte and an electric field, magnetic field or electromagnetic field through the pad material to the substrate, wherein the communicating means is an array of holes extending through the pad material and arranged in a radial direction from a center of the pad material; and

an adhesive system on the bottom surface, wherein the adhesive system is configured to block at least one of the holes to control distribution of at least one of the electric field and the electromagnetic field through the pad material.

2. The pad structure according to claim 1, wherein multiple radially arranged arrays of holes extend through the pad material, the holes of each array being staggered with respect to one another.

3. The pad structure according to claim 1, wherein the cross-sectional openings of said holes increase in size in the radial direction from a center of the pad material, whereby a thickness of deposited material on the substrate increases in a radial direction.

4. The pad structure according to claim 1, wherein larger ones of said array of holes are located near the center of the pad material and smaller ones are arranged near a periphery of the pad material.

5. The pad structure according to claim 1, wherein the adhesive system comprises adhesive material arranged about a periphery of the bottom surface, the adhesive material being arranged about the periphery by one of:

a continuous strip, a plurality of strip segments, a plurality of triangular-shaped adhesive portions and a plurality of circular-shaped adhesive portions.

6. The pad structure according to claim 5, wherein the adhesive system further comprises additional adhesive material arranged inwardly of the periphery of the bottom surface.

7. The pad structure according to claim 1, wherein the adhesive system has defined characteristics to promote or inhibit electric, magnetic or electromagnetic field distributions through the pad material to the substrate.

8. The pad structure according to claim 1, wherein the adhesive system is an adhesive sheet having perforation holes arranged therein.

9. The pad structure according to claim 1, wherein the pad material is formed of:

a top pad material and a subpad material; and

an adhesive securing the top pad material to the subpad material.

10. The pad structure according to claim 9, wherein the communicating means comprises channels arranged in the top pad, subpad, and the adhesive.

11. The pad structure according to claim 9, wherein the subpad material is formed of a flow diffusing fabric, said top pad and adhesive having flow channels formed therein.

12. A pad structure for use in an apparatus for depositing material on, or removing material from, a substrate, the pad structure comprising:

a pad material having a top surface, a bottom surface and a defined thickness;

at least one opening extending between the top surface and the bottom surface, the at least one opening having an inlet at the bottom surface and an outlet at the top surface, wherein the at least one opening is adapted to communicate electrolyte and an electric field, magnetic field or electromagnetic field through the pad material to the substrate, wherein the substrate is exposed to the outlet and wherein the at least one opening is a slit extending across a substantial portion of the diameter of the pad material, said slit also extending through the pad material; and

an adhesive system on the bottom surface, wherein the adhesive system is configured to block at least a portion of the inlet and configured to control distribution of at least one of the electric field and the electromagnetic field through the pad material.

13. The pad structure according to claim 12, wherein the at least one opening is a radially oriented slit extending through the pad material.

14. The pad structure according to claim 12, wherein the at least one opening is an arc-segmentally-shaped slit extending through the pad material.

15. The pad structure according to claim 12, wherein the at least one opening further comprises a plurality of holes extending through the pad material and a plurality of slits extending through the pad material.

16. The pad structure according to claim 15, wherein a number of said plurality of slits are located near an edge of the pad material, whereby an increased thickness of deposited material near an edge of the substrate is obtainable.

17. The pad structure according to claim 12, wherein the at least one opening includes a plurality of channels formed through the pad material, some of which interact with a pad support to allow both electrolyte and electric field flow therethrough and others of which allow only electric field flow therethrough.

18. A pad for polishing a surface of a substrate comprising:

a plurality of channels formed therein, wherein the plurality of channels extend between a first surface and an opposite second surface of the pad, wherein at least one of the plurality of channels has an outlet exposed, wherein the surface of the substrate is exposed to the outlet, and wherein the plurality of channels are cylindrical and the channels include a diameter from 0.5 mm to 5 mm; and

an adhesive system on one of the first and second surfaces, wherein the adhesive system is configured to block at least one of the channels to control distribution of at least one of an electric field and electromagnetic field through the pad.

19. The pad according to claim 18, wherein the channels are spaced apart from each other up to a distance of one to four times the channel diameter.

20. The pad according to claim 18, wherein the plurality of channels are adapted to flow a solution through the pad.

21. The pad according to claim 18, wherein the plurality of channels includes varied sized channels as a function of distance from a center of the pad.

22. The pad according to claim 21, wherein the plurality of channels increase in diametrical channel size with distance from the center of the pad.

23. The pad according to claim 21, wherein the plurality of channels decrease in diametrical channel size with distance from the center of the pad.

24. The pad according to claim 18 further comprising a support structure attached to an undersurface of the pad.

25. A pad for polishing a surface of a substrate comprising:

a plurality of channels formed therein;

a polishing surface having a plurality of grooves disposed thereon, wherein a portion of the plurality of grooves intersect the plurality of channels, wherein the plurality of channels extend between the polishing surface and a bottom surface opposite the polishing surface; and

an adhesive system on the bottom surface, wherein the adhesive system is non-porous under at least one of the channels and to configured to control distribution of at least one of an electric field and electromagnetic field through the pad.

26. The pad according to claim 25, wherein the polishing surface includes hard abrasive particles disposed thereon.

27. A pad for polishing a surface of a substrate comprising:

a plurality of channels formed therein;

a polishing surface having a plurality of grooves disposed thereon, wherein the plurality of grooves extend transversely with respect to one another, wherein the plurality of channels extend between the polishing surface and a bottom surface opposite the polishing surface; and

an adhesive system on the bottom surface, wherein the adhesive system is non-porous under at least one of the channels and to configured to control distribution of at least one of an electric field and electromagnetic field through the pad.

28. The pad according to claim 27, wherein side walls of the grooves are inclined with respect to a vertical plane.

29. The pad according to claim 27, wherein side walls of the grooves are vertical with respect to a horizontal plane.

30. A pad for polishing a surface of a substrate comprising:

a plurality of channels formed therein, wherein the plurality of channels extend between a polishing surface and an opposite undersurface of the pad, wherein at least one of the plurality of channels has an outlet exposed, wherein the surface of the substrate is exposed to the outlet;

an adhesive system on one of the first and second surfaces, wherein the adhesive system is configured to block at least one of the channels to control distribution of at least one of an electric field and electromagnetic field through the pad; and

a support structure attached to the undersurface of the pad by the adhesive system, wherein the support structure includes a plurality of channels disposed therein and adapted to flow material therethrough and at least a portion of the plurality of channels in the pad are aligned with the plurality of channels in the support structure adapted for the flow of the material through the support structure and the pad.

31. The pad structure according to claim 30, further comprising a conductive sheet disposed between the pad and the support structure.

32. The pad structure according to claim 30, further comprising a plurality of grooves disposed on the polishing surface, wherein the plurality of grooves intersect one another.

33. The pad structure according to claim 30, further comprising a plurality of grooves disposed on the polishing surface, wherein a portion of the plurality of grooves intersect a portion of the plurality of channels.

34. The pad structure according to claim 30, wherein the pad is shaped varying in thickness from center to edge.

35. The pad structure according to claim 34, wherein the pad is thinner near the edge.

36. The pad structure according to claim 34, wherein the pad is thicker near the edge.