Wafer-level sealed microdevice having trench isolation and methods for making the same
First Claim
1. A method of making a microdevice having a hermetically sealed cavity, the method comprising the steps of:
- providing a substrate having a top side and a bottom side;
forming a conductive trace on the top side of the substrate, the conductive trace having a first end and a second end;
forming an isolation layer over at least a portion of the top side of the substrate and the conductive trace;
forming a gap in the substrate;
attaching a microstructure to the first end of the conductive trace so that at least a substantial portion of the microstructure is positioned above the gap;
providing a silicon cap and a silicon island, the silicon cap being separated from the silicon island by an isolation trench;
attaching the silicon cap to the isolation layer formed on the top side of the substrate such that the silicon cap houses the microstructure and forms the hermetically sealed cavity; and
attaching the silicon island to the second end of the conductive trace.
3 Assignments
0 Petitions
Accused Products
Abstract
A microdevice (20) having a hermetically sealed cavity (22) to house a microstructure (26). The microdevice (20) comprises a substrate (30), a cap (40), an isolation layer (70), at least one conductive island (60), and an isolation trench (50). The substrate (30) has a top side (32) with a plurality of conductive traces (36) formed thereon. The conductive traces (36) provide electrical connection to the microstructure (26). The cap (40) has a base portion (42) and a sidewall (44). The sidewall (44) extends outwardly from the base portion (42) to define a recess (46) in the cap (40). The isolation layer (70) is attached between the sidewall (44) of the cap (40) and the plurality of conductive traces (36). The conductive island (60) is attached to at least one of the plurality of conductive traces (36). The isolation trench (50) is positioned between the cap (40) and the conductive island (60) and may be unfilled or at least partially filled with an electrically isolating material. There is also a method of making the same microdevice.
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Citations
18 Claims
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1. A method of making a microdevice having a hermetically sealed cavity, the method comprising the steps of:
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providing a substrate having a top side and a bottom side; forming a conductive trace on the top side of the substrate, the conductive trace having a first end and a second end; forming an isolation layer over at least a portion of the top side of the substrate and the conductive trace; forming a gap in the substrate; attaching a microstructure to the first end of the conductive trace so that at least a substantial portion of the microstructure is positioned above the gap; providing a silicon cap and a silicon island, the silicon cap being separated from the silicon island by an isolation trench; attaching the silicon cap to the isolation layer formed on the top side of the substrate such that the silicon cap houses the microstructure and forms the hermetically sealed cavity; and attaching the silicon island to the second end of the conductive trace. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of making a microdevice having a hermetically sealed cavity, the method comprising the steps of:
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providing a substrate having a top side and a bottom side; forming a conductive trace on the top side of the substrate; forming an isolation layer over at least a portion of the top side of the substrate and the conductive trace; forming a first contact window and a second contact window in the isolation layer; forming metal traces over the first and second contact windows to allow electrical connection to the conductive trace under the isolation layer; forming a gap on top side of the substrate; attaching a microstructure to the top side of the substrate above the gap and connecting the microstructure to the metal traces that are over the contact windows; providing a silicon cap and a silicon island, the silicon cap being separated from the silicon island by an isolation trench; attaching the silicon cap to the isolation layer formed on the top side of the substrate such that the silicon cap houses the microstructure and forms the hermetically sealed cavity; and attaching the silicon island to the conductive trace through the second contact window. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of making a microdevice having a hermetically sealed cavity, the method comprising the steps of:
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providing a substrate having a top side and a bottom side; forming a conductive trace on the top side of the substrate, the conductive trace having a first end and a second end; forming a gap on the top side of the substrate; attaching a microstructure to the first end of the conductive trace so that at least a substantial portion of the microstructure is positioned above the gap; providing a silicon cap having a base portion and a sidewall, the sidewall extending outwardly from the base portion to define a recess in the cap; providing a silicon island having a height greater than the sidewall of the silicon cap, the silicon island being separated from the silicon cap by an isolation trench; providing a frit glass layer between an end portion of the sidewall of the silicon cap and at least a portion of the conductive trace; and attaching the silicon cap and the silicon island to the substrate such that the silicon cap houses the microstructure and forms the hermetically sealed cavity. - View Dependent Claims (18)
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Specification