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System and methods for polishing a wafer

  • US 7,378,355 B2
  • Filed: 05/11/2005
  • Issued: 05/27/2008
  • Est. Priority Date: 05/09/1997
  • Status: Expired due to Fees
First Claim
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1. A method for smoothing a surface of a wafer, comprising:

  • forming a liquid layer on a surface of the wafer, with the liquid layer including an acid;

    directing a flow of an oxidizing gas across the liquid layer, with the flow of oxidizing gas thinning the liquid layer at high points on the surface of the wafer more than at low points on the wafer surface; and

    with the flow of oxidizing gas oxidizing and removing at least one micron of wafer material from the high points on the wafer surface, to smooth the wafer surface.

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