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Plasma treatment at film layer to reduce sheet resistance and to improve via contact resistance

  • US 7,378,744 B2
  • Filed: 05/22/2006
  • Issued: 05/27/2008
  • Est. Priority Date: 05/10/2004
  • Status: Expired due to Fees
First Claim
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1. A system for manufacturing a semiconductor device, comprising:

  • means for forming an insulating layer over a substrate;

    means for forming an agglutinating layer over the insulating layer;

    means for plasma treating the agglutinating layer to enlarge its grain size;

    means for forming a barrier layer over the plasma-treated agglutinating layer; and

    means for forming a conductive layer over the barrier layer.

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