RFID tag using a surface insensitive antenna structure

• US 7,379,024 B2
• Filed: 12/08/2006
• Issued: 05/27/2008
• Est. Priority Date: 04/10/2003
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Corporation
• Inventors: Forster, Ian J., Farr, Adrian N., Howard, Norman A., Holman, Andrew W.
• Primary Examiner(s): MANCUSO, HUEDUNG XUAN CAO
• Application Number:
  US11/636,091
• Publication Number:
  US 20070080233A1
• Time in Patent Office: 536 Days
• Field of Search: 343/700.MS, 343/702, 343/895, 3405721-572
• US Class Current: 343/700.0MS
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object

Abstract

An RFID device includes conductive tabs, and a conductive structure, with a dielectric layer between the conductive tabs and the conductive structure. The conductive structure overlaps the conductive tabs and acts as a shield, allowing the device to be at least somewhat insensitive to the surface upon which it is mounted, or to the presence of nearby objects, such as goods in a carton or other container that includes the device. The dielectric layer may be a portion of the container, such as an overlapped portion of the container. Alternatively, the dielectric layer may be a separate layer, which may vary in thickness, allowing one of the conductive tabs to be capacitively coupled to the conductive structure. As another alternative, the dielectric layer may be an expandable substrate that may be expanded after fabrication operations, such as printing.

Claims

1. A radio frequency identification (RFID) device comprising:

a pair of conductive tabs on a first surface of the dielectric layer;

a conductive structure; and

a dielectric layer between the conductive tabs and the conductive structure;

wherein the dielectric layer has a thinner portion and a thicker portion; and

wherein one of the conductive tabs is at least partially on the thinner portion of the dielectric layer.

2. The device of claim 1, wherein the other of the conductive tabs is substantially completely on the thicker portion of the dielectric layer.

3. The device of claim 1,

wherein the one of the conductive tabs is capacitively coupled to the conductive structure across the thinner portion;

and

wherein the thicker portion inhibits capacitive coupling between the conductive structure and the conductive tabs or portions thereof on an opposite side of the thicker portion.

4. The device of claim 1, wherein both of the conductive tabs are at least partially on the thinner portion of the dielectric layer.

5. The device of claim 1,

wherein the thinned portion is a compressed material;

and

wherein the thinned portion extends substantially fully around the dielectric layer.

6. The device of claim 1, wherein the dielectric material includes a sloped area between the thinner portion and the thicker portion.

7. A method of making the RFID device of claim 1, the method comprising:

forming the pair of conductive tabs on one face of a dielectric layer; and

forming the thinner portion of the dielectric layer.

8. The method of claim 7, wherein the forming the thinner portion includes applying both a compressing force generally perpendicular to the face of the dielectric layer, and a sideways force generally parallel to the face of the dielectric layer.