Method of manufacturing a printhead wafer etched from opposing sides

• US 7,380,339 B2
• Filed: 10/07/2004
• Issued: 06/03/2008
• Est. Priority Date: 10/16/1998
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): TUGBANG, ANTHONY D
• Application Number:
  US10/959,049
• Publication Number:
  US 20050109730A1
• Time in Patent Office: 1,335 Days
• Field of Search: 298/901, 296/11, 298/31, 298/46, 438/21, 216/27, 347/44, 347/47, 347/54, 347/56, 347/63
• US Class Current: 29/890.1
• CPC Class Codes: B41J 2/04528 aiming at warming up the head
• CPC Class Codes: B41J 2/04541 Specific driving circuit
• CPC Class Codes: B41J 2/04543 Block driving
• CPC Class Codes: B41J 2/04553 detecting ambient temperature
• CPC Class Codes: B41J 2/04563 detecting head temperature; Ink temperature
• CPC Class Codes: B41J 2/04585 controlling heads based on thermal bent actuators
• CPC Class Codes: B41J 2/04588 using a specific waveform
• CPC Class Codes: B41J 2/04591 Width of the driving signal being adjusted
• CPC Class Codes: B41J 2/04596 Non-ejecting pulses
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1637 molding
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/175 : Ink supply systems ; Circuit parts therefor
• CPC Class Codes: B41J 2002/14362 : Assembling elements of heads
• CPC Class Codes: B41J 2002/14419 : Manifold
• CPC Class Codes: B41J 2002/14491 : Electrical connection
• CPC Class Codes: Y10T 29/49083 : Heater type
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/494 : Fluidic or fluid actuated device making
• CPC Class Codes: Y10T 29/49401 : Fluid pattern dispersing device making, e.g., ink jet

Abstract

A method of fabricating an inkjet printhead with a wafer substrate that has an ink ejection side and an opposing ink inlet side. The printhead has an array of nozzles formed on the ink ejection side, and an array of ink inlets formed in the ink inlet side. Each nozzle is individually associated with a respective ink inlet. The method comprises the steps of forming the array of nozzles using lithographically masked etching and deposition techniques, and, etching individual feed paths through the wafer substrate between each of the nozzles and its associated ink inlet. Feeding the ink to the nozzles by individual feed paths through the wafer, increases the nozzle packing density and the resolution.

Claims

1. A method of fabricating a printhead for an inkjet printer, the printhead comprising:

a wafer substrate defined by two outer planar surfaces that are parallel and spaced apart by the wafer substrate thickness, one of the two outer planar surfaces being an ink ejection surface and the other of the two outer planar surfaces being an opposing ink inlet surface, wherein an array of nozzles are formed on the ink ejection surface, the array of nozzles formed in a plurality of rows and columns, and a corresponding array of ink inlets are formed in the ink inlet surface, the array of inlets formed in a plurality of rows and columns, wherein during use, each ink inlet in the corresponding array of ink inlets supplies ink to one respective nozzle in the nozzle array;

the method comprising the steps of;

forming the plurality of rows and columns of the array of nozzles in the ink ejection surface using lithographically masked etching and deposition techniques; and

,

etching individual feed paths through the wafer substrate thickness between each nozzle in the nozzle array and the respective ink inlet in the plurality of rows and columns of the array of ink inlets in the opposing ink inlet surface.

2. A method according to claim 1 wherein the individual feed paths are partially etched from the ink ejection surface of the wafer substrate and partially etched from the ink inlet surface of the wafer substrate.

3. A method according to claim 1 wherein each of the nozzles have an ejection actuator and an ejection aperture for ejecting drops of ink towards a media substrate.

4. A method according to claim 3 wherein the array of ink inlets is in registration with the ejection apertures such that the fluid path is normal to the plane of the wafer substrate.

5. A method according to claim 3 wherein the printhead further comprises CMOS drive circuitry for controlling the actuation of the ejection actuators.

6. A method according to claim 1 wherein each of the fluid paths are longer than 100 microns.

7. A method according to claim 1 wherein the printhead has more than 30000 nozzles per cm² of the wafer substrate.

8. A method according to claim 1 wherein the printhead is a pagewidth printhead with a resolution greater than 1000 d.p.i.

9. A method according to claim 3 wherein the ejection actuator is a thermal bend actuator for displacing ink within the nozzle to eject a drop through the ejection aperture.