Silicon condenser microphone and manufacturing method
First Claim
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1. A method of manufacturing a microphone comprising:
- providing a first panel comprising a plurality of bottom layer portions for a corresponding plurality of microphones;
providing a second panel comprising a plurality of top layer portions for the corresponding plurality of microphones;
disposing a transducer on each of the plurality of bottom layer portions or each of the plurality of top layer portions;
securing the first panel to the second panel to form cavities defined by each top layer portion and each bottom layer portion enclosing each transducer; and
separating microphones from the joined first panel and second panel,wherein each of the bottom layer portions or each of the top layer portions comprising an acoustic port, the transducer being coupled via the cavity to the acoustic port.
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Abstract
A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
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12 Claims
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1. A method of manufacturing a microphone comprising:
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providing a first panel comprising a plurality of bottom layer portions for a corresponding plurality of microphones; providing a second panel comprising a plurality of top layer portions for the corresponding plurality of microphones; disposing a transducer on each of the plurality of bottom layer portions or each of the plurality of top layer portions; securing the first panel to the second panel to form cavities defined by each top layer portion and each bottom layer portion enclosing each transducer; and separating microphones from the joined first panel and second panel, wherein each of the bottom layer portions or each of the top layer portions comprising an acoustic port, the transducer being coupled via the cavity to the acoustic port. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification