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Method for integrating MEMS device and interposer

  • US 7,381,630 B2
  • Filed: 07/13/2004
  • Issued: 06/03/2008
  • Est. Priority Date: 01/02/2001
  • Status: Expired due to Term
First Claim
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1. A method for manufacturing a Microelectromechanical Systems (MEMS) assembly, said method comprising:

  • obtaining an SOI wafer, which comprises;

    (i) a handle layer,(ii) a dielectric layer on said handle layer, and(iii) a device layer on said dielectric layer;

    etching said device layer of said SOI wafer to at least partially define said MEMS device;

    obtaining an interposer wafer;

    bonding said SOI wafer to said interposer wafer in a way such that said device layer of said SOI wafer faces said interposer wafer;

    removing said handle layer of said SOI wafer; and

    removing said dielectric layer of the SOI wafer,wherein said bonding said SOI wafer to said interposer wafer comprises direct bonding.

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