Acoustic transducer module

• US 7,382,048 B2
• Filed: 04/28/2005
• Issued: 06/03/2008
• Est. Priority Date: 02/28/2003
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Minervini, Anthony D.
• Primary Examiner(s): Chambliss; Alonzo
• Application Number:
  US11/117,134
• Publication Number:
  US 20060116180A1
• Time in Patent Office: 1,132 Days
• Field of Search: None
• US Class Current: 257/723
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04R 1/028 associated with devices performing functions other than acoustics, e.g. electric candles
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2499/11 Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Abstract

A module (100, 200, 300, 400, 500, 600, 900) may be electrically connected to a PCB (18, 918) residing in a device (14) or may be joined to the device (14) to form a portion of the housing (16, 916) of the device (14). The module may include a housing (102, 202, 302, 402, 502, 602) having at least one layer, a surface mountable component, such as a surface mountable acoustic transducer (110, 210, 310, 410, 510, 610, 910) having a connecting surface (114, 214, 314, 414, 514, 614, 914), and at least one acoustic port (124, 224, 324, 424, 524, 624, 924) to couple a surface of the surface mountable acoustic transducer to the exterior of the device (14). The module (100, 200, 300, 400, 500, 600, 900) may further include a secondary mounting structure (654) electrically connected to the connecting surface (114, 214, 314, 414, 514, 614, 914) of the surface mountable acoustic transducer (110, 210, 310, 410, 510, 610, 910). The acoustic port (124, 224, 324, 424, 524, 624, 924) may include a layer of an environmental barrier (450, 550).

Claims

1. An electronic device comprising:

a housing defining an interior and an exterior of the housing;

a surface mountable acoustic transducer disposed within the interior, the surface mountable acoustic transducer having a first surface for electrically coupling the surface mounted acoustic transducer to a printed circuit board at least partially disposed within the interior and a second surface adapted to be exposed to the exterior; and

at least one acoustic pathway formed within the housing, the acoustic pathway coupling the second surface to the exterior.

2. The electronic device of claim 1, wherein the first surface and the second surface are formed in a common surface of the surface mountable acoustic transducer.

3. The electronic device of claim 1, the surface mountable acoustic transducer comprising a third surface, different than the second surface, the third surface being adapted to be exposed to the exterior;

and a second acoustic pathway formed in the housing coupling the third surface to the exterior.

4. The electronic device of claim 1, an aperture formed in the printed circuit board, the aperture forming a portion of the acoustic pathway.

5. The electronic device of claim 4, the aperture extending through the printed circuit board from a first surface of the printed circuit board to a second surface of the printed circuit board, the second surface of the surface mounted acoustic transducer being disposed adjacent the first surface of the printed circuit board.

6. The electronic device of claim 5, the first surface of the surface mounted acoustic transducer being disposed adjacent the first surface of the printed circuit board.

7. The electronic device of claim 4, an acoustic seal disposed about the aperture between the surface mounted acoustic transducer and the printed circuit board.

8. The electronic device of claim 4, an acoustic seal disposed about the aperture between the printed circuit board and the housing.

9. The electronic device of claim 1, an aperture formed in the housing, the aperture forming a portion of the acoustic pathway.

10. The electronic device of claim 9, an acoustic seal disposed about the aperture between the printed circuit board and the housing.