Method and device for fabricating a release structure to facilitate bonding of mirror devices onto a substrate
First Claim
1. A method of fabricating a spatial light modulator, the method comprising:
- providing a first substrate having a mirror layer, the mirror layer having an upper surface and a lower surface;
forming a standoff structure from the first substrate, the standoff structure having an integrated surface coupled to the lower surface of the mirror layer and a bonding surface opposite the integrated surface, the standoff structure comprising;
a centrally located base section extending from the integrated surface to the bonding surface along a first axis; and
a plurality of lateral extension arms extending from the base section along a second axis orthogonal to the first axis;
providing a second substrate having a bonding surface and a support surface;
joining the bonding surface of the standoff structure to the bonding surface of the second substrate; and
releasing a portion of the first substrate to form a torsion spring hinge coplanar with the mirror layer.
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Abstract
A method of fabricating a spatial light modulator. The method includes providing a first substrate having a mirror layer, the mirror layer having an upper surface and a lower surface. The method also includes forming a standoff structure from the first substrate, the standoff structure having an integrated surface coupled to the lower surface of the mirror layer and a bonding surface opposite the integrated surface. The standoff structure includes a centrally located base section extending from the integrated surface to the bonding surface along a first axis and a plurality of lateral extension arms extending from the base section along a second axis orthogonal to the first axis. The method further includes providing a second substrate having a bonding surface and a support surface, joining the bonding surface of the standoff structure to the bonding surface of the second substrate, and releasing a portion of the first substrate to form a torsion spring hinge coplanar with the mirror layer.
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Citations
22 Claims
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1. A method of fabricating a spatial light modulator, the method comprising:
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providing a first substrate having a mirror layer, the mirror layer having an upper surface and a lower surface; forming a standoff structure from the first substrate, the standoff structure having an integrated surface coupled to the lower surface of the mirror layer and a bonding surface opposite the integrated surface, the standoff structure comprising; a centrally located base section extending from the integrated surface to the bonding surface along a first axis; and a plurality of lateral extension arms extending from the base section along a second axis orthogonal to the first axis; providing a second substrate having a bonding surface and a support surface; joining the bonding surface of the standoff structure to the bonding surface of the second substrate; and releasing a portion of the first substrate to form a torsion spring hinge coplanar with the mirror layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of fabricating a support structure for a spatial light modulator, the method comprising:
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providing a first substrate having a mirror layer and a support layer, the mirror layer having an upper surface and a lower surface and the support layer having an integrated surface coupled to the lower surface of the mirror layer and a bonding surface opposite the integrated surface; providing a second substrate having a bonding surface and a support surface opposite the bonding surface; joining the bonding surface of the support layer of the first substrate to the bonding surface of the second substrate; and releasing a portion of the first substrate to form a torsion spring hinge coplanar with the mirror layer. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. A method of fabricating a spatial light modulator, the method comprising:
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forming an electrode layer on a first substrate; forming a bonding surface on the first substrate; forming a standoff structure from a portion of a second substrate, wherein the standoff structure comprises a bonding surface; joining the bonding surface of the standoff structure to the bonding surface of the first substrate; removing a portion of the second substrate to expose a mirror layer; and removing a portion of the mirror layer and the standoff structure to form a torsion spring hinge. - View Dependent Claims (19, 20, 21, 22)
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Specification