Security tag system for fabricating a tag including an integrated surface processing system

• US 7,384,496 B2
• Filed: 11/24/2004
• Issued: 06/10/2008
• Est. Priority Date: 02/23/2004
• Status: Active Grant

• Current Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Original Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Inventors: Cote, Andre, Clare, Thomas J., Eckstein, Eric
• Primary Examiner(s): Mayes; Melvin C
• Application Number:
  US10/996,786
• Publication Number:
  US 20050183817A1
• Time in Patent Office: 1,294 Days
• Field of Search: 156/267, 156/277
• US Class Current: 156/277
• CPC Class Codes: B32B 2310/0843 using laser
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 37/025 Transfer laminating
• CPC Class Codes: G08B 13/2414 using inductive tags
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/09672 Superposed layout, i.e. in different planes
• CPC Class Codes: H05K 2203/0522 Using an adhesive pattern
• CPC Class Codes: H05K 2203/0528 Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1041 Subsequent to lamination
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing
• CPC Class Codes: Y10T 156/1062 Prior to assembly
• CPC Class Codes: Y10T 156/1077 Applying plural cut laminae to single face of additional lamina
• CPC Class Codes: Y10T 156/108 Flash, trim or excess removal
• CPC Class Codes: Y10T 156/1082 Partial cutting bonded sandwich [e.g., grooving or incising]
• CPC Class Codes: Y10T 156/1089 of discrete laminae to single face of additional lamina
• CPC Class Codes: Y10T 156/1097 Lamina is running length web
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 : with selective destruction of conductive paths

Abstract

A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.

Claims

1. A method for forming a series of items having human readable printed indicia and EAS or RFID security circuitry integral with said items, each of said items comprising at least a portion of a product to be protected by said security circuitry or a package for a product to be protected by said security circuitry or some other printed material packaged with a product to be protected by said security circuitry, each of said items not being an EAS or RFID security tag itself, each of said items having a surface, said method comprising the steps of:

a) providing an integrated surface processing system including a printing device and a security circuit fabrication device, said security circuit fabrication device being arranged for fabricating in situ said EAS or RFID security circuitry on each of said items;

b) providing a first adhesive in a predetermined pattern to said surface of each of said items using said security circuit fabrication device;

c) applying a first conductive foil to said first adhesive on each of said items using said security fabrication device;

d) die cutting said first conductive foil corresponding to said pattern and removing remaining portions of said first conductive foil from each of said items using said security fabrication device to thereby form a first conductive trace in situ upon said surface of each of said items, said first conductive trace forming a component of said security circuitry and being integral with said item;

e) printing indicia on at least a portion of each of said items by said printing device to thereby form said series of items, with said security circuitry being integral therewith and located at a predetermined position with respect to said indicia;

f) providing a second adhesive in a predetermined pattern to a portion of a surface area of said item, said surface area comprising said surface and said first conductive trace;

g) applying a second conductive foil to said second adhesive to adhere said second conductive foil to said surface area forming a second conductive trace; and

h) electrically coupling portions of said first and second conductive traces to each other.

2. The method of claim 1, wherein said printing device comprises a device for applying visible indicia to said surface of said item.

3. The method of claim 2, wherein said visible indicia comprises said human readable indicia.

4. The method of claim 2, wherein said visible indicia comprises machine readable indicia.

5. The method of claim 2, wherein said visible indicia is applied to said surface of said item substantially contemporaneously with said forming of said conductive trace.

6. The method of claim 1, comprising the further step of completing the formation of said security circuitry on each of said items using said security fabrication device.

7. The method of claim 6, wherein a dielectric material having a surface is coupled to said first conductive trace and wherein said step of completing the formation of said security circuitry on each of said items comprises the further step of scratching said surface of said dielectric material to provide a deactivation point.

8. The method of claim 7, wherein said dielectric material has two surfaces and wherein said step of completing the formation of said security circuitry on each of said items comprises the further step of scratching said two surfaces of said dielectric material to provide said deactivation point.

9. The method of claim 6, wherein said surface is a first surface, said item comprising a second surface different than said first surface, and wherein said method additionally comprises processing at least a portion of said second surface of said item.

10. The method of claim 1, wherein said printing device comprises a flexographic printer.

11. The method of claim 10, wherein said security circuit fabrication device comprises a flexographic printer.

12. The method of claim 10, wherein said security circuit fabrication device comprises a silk screen device.

13. The method of claim 10, wherein said security circuit fabrication device comprises a tampo device.

14. The method of claim 10, wherein said security circuit fabrication device comprises a gravure printing device.

15. The method of claim 1, wherein said security fabrication device comprises a vacuum device and wherein said step of removing remaining portions of said first conductive foil is accomplished using said vacuum device.

16. The method of claim 1, wherein said die cutting said first conductive foil is accomplished substantially simultaneously with said removing of said remaining portions of said first conductive foil.

17. The method of claim 1, comprising the further step of providing a deactivation point by dimpling said first and second conductive traces, whereupon said first and second conductive traces are disposed relatively closer to each other.