Nanoparticle-based power coatings and corresponding structures

• US 7,384,680 B2
• Filed: 07/15/2002
• Issued: 06/10/2008
• Est. Priority Date: 07/21/1997
• Status: Expired due to Fees

• Current Assignee: NeoPhotonics Corporation (Lumentum Holdings Inc.)
• Original Assignee: Nanogram Corporation (Teijin Limited)
• Inventors: Kambe, Nobuyuki, Chiruvolu, Shivkumar, Kumar, Sujeet, Horne, Craig R., Bi, Xiangxin, Mosso, Ronald J., DeMascarel, Pierre J., Gardner, James T., Lynch, Robert B., McGovern, William E.
• Primary Examiner(s): LE, HOA T
• Application Number:
  US10/195,851
• Publication Number:
  US 20030203205A1
• Time in Patent Office: 2,157 Days
• Field of Search: 428/143, 428/149, 428/148, 428/156, 428/323, 428/28, 428/331, 428/697, 428/698, 428/702
• US Class Current: 428/143
• CPC Class Codes: B01J 2/006 Coating of the granules without description of the process or the device by which the granules are obtained to prevent the granules sticking together B01J2/30
• CPC Class Codes: B22F 1/052 characterised by a mixture of particles of different sizes or by the particle size distribution
• CPC Class Codes: B22F 1/054 Nanosized particles
• CPC Class Codes: B22F 1/0545 Dispersions or suspensions of nanosized particles
• CPC Class Codes: B22F 1/056 Submicron particles having a size above 100 nm up to 300 nm
• CPC Class Codes: B22F 2202/11 Use of irradiation
• CPC Class Codes: B22F 2998/00 Supplementary information concerning processes or compositions relating to powder metallurgy
• CPC Class Codes: B22F 2999/00 Aspects linked to processes or compositions used in powder metallurgy
• CPC Class Codes: B22F 9/16 using chemical processes
• CPC Class Codes: B22F 9/30 with decomposition of metal compounds, e.g. by pyrolysis
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: C23C 24/04 Impact or kinetic deposition of particles
• CPC Class Codes: C23C 24/10 with intermediate formation of a liquid phase in the layer
• CPC Class Codes: C23C 4/123 Spraying molten metal
• CPC Class Codes: Y10T 428/24372 Particulate matter
• CPC Class Codes: Y10T 428/24413 Metal or metal compound
• CPC Class Codes: Y10T 428/24421 Silicon containing
• CPC Class Codes: Y10T 428/24479 including variation in thickness
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/256 Heavy metal or aluminum or compound thereof
• CPC Class Codes: Y10T 428/259 : Silicic material
• CPC Class Codes: Y10T 428/2982 : Particulate matter [e.g., sphere, flake, etc.]

Abstract

Methods are described that have the capability of producing submicron/nanoscale particles, in some embodiments dispersible, at high production rates. In some embodiments, the methods result in the production of particles with an average diameter less than about 75 nanometers that are produced at a rate of at least about 35 grams per hour. In other embodiments, the particles are highly uniform. These methods can be used to form particle collections and/or powder coatings. Powder coatings and corresponding methods are described based on the deposition of highly uniform submicron/nanoscale particles.

Claims

1. A substrate comprising a powder coating comprising an inorganic composition, the powder coating comprising primary particles having an average particle size less than about 500 nm and effectively no primary particles having a diameter greater than about 4 times the average primary particle diameter wherein the powder coating has an approximately uniform thickness across at least a portion of a substrate surface and wherein the powder coating forms a porous network of fused inorganic particles wherein the powder coating has a thickness from about 50 nm to about 500 microns.

2. The substrate of claim 1 wherein the average primary particle size is less than about 100 nm.

3. The substrate of claim 1 wherein the average primary particle size is less than about 50 nm.

4. The substrate of claim 1 wherein effectively no primary particles have a diameter greater than about 3 times the average primary particle diameter.

5. The substrate of claim 1 wherein effectively no primary particles have a diameter greater than about 2 times the average primary particle diameter.

6. The substrate of claim 1 wherein the primary particles have a distribution in diameters with at least about 95 percent of the primary particles having a diameter greater than about 40 percent of the average diameter and less than about 225 percent of the average diameter.

7. The substrate of claim 1 wherein the primary particles have a distribution of diameters with at least about 95 percent of the primary particles having a diameter greater than about 45 percent of the average diameter and less than about 200 percent of the average diameter.

8. The substrate of claim 1 wherein the particles comprise silicon oxide.

9. The substrate of claim 1 wherein the particles comprise a metal oxide.

10. The substrate of claim 9 wherein the metal oxide comprises a rare earth metal.

11. The substrate of claim 1 wherein the particles comprise a plurality of metalloid compounds.

12. The substrate of claim 1 wherein the particles comprise a plurality of metal compounds.

13. The substrate of claim 1 wherein powder coating has a thickness of no more than about 250 microns.

14. The substrate of claim 1 wherein the powder coating has a thickness from about to about 100 nanometers to about 50 microns.

15. The substrate of claim 1 having approximately a uniform thickness across the powder coating.

16. The substrate of claim 1 wherein the powder coating has a different thickness along different portions of the substrate.

17. The substrate of claim 16 wherein the substrate comprises silicon.

18. The substrate of claim 1 having a density less than about 0.6 times the density of the fully densified material of the powder coating.

19. The substrate of claim 1 having a density from about 0.05 to about 0.4 times the density of the fully densified material of the powder coating.

20. A device comprising the substrate of claim 1.

21. The substrate of claim 1 wherein the coating is smooth.

22. The substrate of claim 1 wherein the coating is on a silicon wafer.

23. The substrate of claim 1 wherein the coating is on a substrate comprising fused silica, quartz, alumina, lithium tantalate, lithium, niobate, gallium arsenide, indium phosphide, soda-lime silicate glass, borosilicate glass, and aluminosilicate glass.

24. The substrate of claim 1 wherein the coating is patterned on the substrate.

25. The substrate of claim 1 wherein the coating is on a planar surface of the substrate.

26. The substrate of claim 1 wherein the particles comprise a metal/metalloid oxide, a metal/metalloid nitride, a metal/metalloid carbide, a metal/metalloid sulfide or a combination thereof.

27. The substrate of claim 1 wherein the particles comprise a metal/metalloid arsinide, a metal/metalloid phosphide, a metal/metalloid selenide, a metal/metalloid telluride or a combination thereof.

28. The substrate of claim 1 wherein the particles comprise a dopant.