Transponder incorporated into an electronic device

• US 7,385,284 B2
• Filed: 11/22/2004
• Issued: 06/10/2008
• Est. Priority Date: 11/22/2004
• Status: Expired due to Fees

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Carrender, Curt
• Primary Examiner(s): Pert, Evan
• Assistant Examiner(s): SANDVIK, BENJAMIN P
• Application Number:
  US10/996,294
• Publication Number:
  US 20060109129A1
• Time in Patent Office: 1,296 Days
• Field of Search: None
• US Class Current: 257/692
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07788 the antenna being of the capacitive type
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/2445 Tag integrated into item to be protected, e.g. source tagging
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/7665 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/82039 using a laser
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate

Abstract

An electronic device. The device comprises a metalization layer and an integrated circuit chip incorporated into the device wherein the integrated circuit chip is capacitively coupled to the metalization layer. The device comprises a first substrate having the metalization layer formed on the substrate, a cap layer covering at least the entire metalization layer and at least a portion of the first substrate not covered by the metalization layer. The integrated circuit chip is coupled to the first substrate, and is placed in proximity and in non-physical contact with the metalization layer. A conductive layer is attached to the integrated circuit chip. The conductive layer has at least a portion placed in a non-physical contact with the metalization layer. The integrated circuit chip is capacitively coupled to the metalization layer through the conductive layer and the metalization layer.

Claims

1. A device, comprising:

a radio frequency identification (RFID) integrated circuit (IC);

a first substrate having a metallization layer configured to store information;

the REID IC configured to capacitively or directly couple to the metallization layer; and

the metallization layer configured to function as an antenna for the RFID IC.

2. The device of claim 1 wherein the integrated circuit is embedded within a second substrate.

3. The device of claim 1 wherein the antenna is at least one of a screen printed metal, thick film silver, hot stamped foil, and thin film metal.

4. The device of claim 1 wherein the metallization layer represents data storage area in at least one of CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, or DVD-RAM.