Ink jet nozzle arrangement with static and dynamic structures

• US 7,387,364 B2
• Filed: 12/22/2006
• Issued: 06/17/2008
• Est. Priority Date: 07/15/1997
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): Do; An H
• Application Number:
  US11/643,845
• Publication Number:
  US 20070103510A1
• Time in Patent Office: 543 Days
• Field of Search: 347/54, 347/65
• US Class Current: 347/54
• CPC Class Codes: B41J 2/04 generating single droplets or particles on demand
• CPC Class Codes: B41J 2/05 produced by the application of heat
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1601 Production of bubble jet print heads B41J2/1606, B41J2/162 take precedence
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2002/14435 Moving nozzle made of thermal bend detached actuator
• CPC Class Codes: B41J 2202/15 Moving nozzle or nozzle plate
• CPC Class Codes: B41J 2202/21 Line printing

Abstract

A nozzle arrangement for a printhead integrated circuit is configured to be replicated on a wafer substrate incorporating drive circuitry so that the printhead integrated circuit comprises an array of the nozzle arrangements. The nozzle arrangement includes a static nozzle chamber structure extending from the wafer substrate and bounding an ink inlet channel defined through the wafer substrate. A dynamic nozzle chamber structure is arranged on the static nozzle chamber structure so that the static and dynamic nozzle chamber structures together define a nozzle chamber in fluid communication with the ink inlet channel. The dynamic nozzle chamber structure defines an ink ejection port and is displaceable relative to the substrate so that ink is ejected from the ink ejection port due to volumetric change in the nozzle chamber. An actuating mechanism is fast with the substrate and the dynamic nozzle chamber structure and is electrically connected to the drive circuitry to receive drive signals from the drive circuitry so that the dynamic nozzle chamber structure is reciprocally displaced to eject ink from the ink ejection port.

Claims

1. A nozzle arrangement for a printhead integrated circuit, the nozzle arrangement being configured to be replicated on a wafer substrate incorporating drive circuitry so that the printhead integrated circuit comprises an array of the nozzle arrangements, the nozzle arrangement comprising

a static nozzle chamber structure extending from the wafer substrate and bounding an ink inlet channel defined through the wafer substrate;

a dynamic nozzle chamber structure arranged on the static nozzle chamber structure so that the static and dynamic nozzle chamber structures together define a nozzle chamber in fluid communication with the ink inlet channel, the dynamic nozzle chamber structure defining an ink ejection port and being displaceable relative to the substrate so that ink is ejected from the ink ejection port due to volumetric change in the nozzle chamber; and

an actuating mechanism fast with the substrate and the dynamic nozzle chamber structure and electrically connected to the drive circuitry to receive drive signals from the drive circuitry so that the dynamic nozzle chamber structure is reciprocally displaced to eject ink from the ink ejection port.

2. A nozzle arrangement as claimed in claim 1, in which the actuating mechanism comprises an elongate, micro-electromechanical actuator fast at one end to the substrate and connected to the drive circuitry and an elongate connecting member fast with and interposed between the actuator and the dynamic nozzle chamber structure.

3. A nozzle arrangement as claimed in claim 2, which includes an anchor that extends from the substrate, the actuator being a thermal bend actuator that is fast with and extends from the anchor.

4. A nozzle arrangement as claimed in claim 3, which includes conductive pads arranged on the substrate and connected between the drive circuitry and the anchor to form an electrical connection with the actuator.

5. A nozzle arrangement as claimed in claim 3, in which the actuator includes an active beam and a passive beam interposed between the active beam and the substrate, at least the active beam defining a heating circuit connected to the conductive pads and capable of thermal expansion, the beams being fast with respect to each other with the passive beam electrically isolated so that the actuator experiences differential thermal expansion when a current is set up in the active beam, thus causing the actuator and the dynamic nozzle chamber structure to deflect towards the substrate.

6. A nozzle arrangement as claimed in claim 5, in which both the beams are of a conductive ceramic material.

7. A nozzle arrangement as claimed in claim 1, in which the dynamic nozzle chamber structure includes a crown portion that defines the ink ejection port and a skirt portion that depends from the crown portion and overlaps the static nozzle chamber structure when the dynamic nozzle chamber structure is displaced towards the substrate.