Modular mounting arrangement and method for light emitting diodes

• US 7,387,406 B2
• Filed: 12/06/2005
• Issued: 06/17/2008
• Est. Priority Date: 06/29/2001
• Status: Expired due to Fees

• Current Assignee: Permlight Products Inc
• Original Assignee: Permlight Products Inc
• Inventors: Swaris, Jagath, Ness, Scott Van
• Primary Examiner(s): O'Shea; Sandra
• Assistant Examiner(s): Tsidulko; Mark
• Application Number:
  US11/294,974
• Publication Number:
  US 20060087844A1
• Time in Patent Office: 924 Days
• Field of Search: 362/249, 362/231, 362/250, 362/294, 362/373, 362/640, 257/88, 257/91, 257/99, 257/103, 445 23- 25, 405/44, 405/70, 29/25, 29/26, 29/34, 291/06, 291/22
• US Class Current: 362/249.01
• CPC Class Codes: F21S 4/20 with light sources held by or within elongate supports
• CPC Class Codes: F21V 17/007 with provision for shipment or storage
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G09F 13/0404 the light source being enclosed in a box forming the character of the sign
• CPC Class Codes: G09F 13/22 electroluminescent electroluminescent light sources per se H05B33/00
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/13 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A modular light emitting diode (LED) mounting configuration is provided including a light source module having at least one LED. The module includes a heat conductive body portion adapted to conduct heat generated by the LED away from the LED. As a result, the LED can be operated with a higher current than normally allowed. Thus, LED brightness and performance is increased without decreasing life expectancy. An adhesive connects the LED module to the mount surface. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.

Claims

1. A method of making an illuminated signage system, comprising:

providing a sign member configured according to a desired illumination shape and having a flat surface portion;

providing a plurality of light emitting diode (LED) modules that are electrically interconnected to each other in an electrically parallel arrangement, each of the LED modules comprising;

at least one LED;

a plurality of electrically conductive contacts, the at least one LED electrically communicating with at least one of the contacts;

a dielectric layer having a first side and a second side, the contacts being disposed on the first side; and

a heat conductive body communicating with the second side of the dielectric layer, the heat conductive body configured to absorb heat generated by the at least one LED that flows through the dielectric layer, the heat conductive body comprising a generally flat portion disposed generally opposite the dielectric layer;

providing an adhesive member configured to connect the LED module to the flat surface portion of the sign member, at least part of the heat conductive body being disposed between the dielectric layer and the adhesive member; and

adhering the adhesive member of each module to a surface of the sign member so that the generally flat portion of the heat conductive body is arranged generally complementary to the flat surface portion of the sign member.

2. The method of claim 1, wherein the signage system comprises a channel illumination apparatus, and the sign member comprises a casing having a plurality of side walls and a back wall that cooperate to define a channel, and wherein each module is disposed within the channel.

3. The method of claim 2, wherein at least one LED module is adhered to one of the side walls.

4. The method of claim 2, wherein a plurality of LED modules are arranged spaced apart from one another within the channel, and additionally comprising providing a translucent light diffuser and affixing the light diffuser to the casing so as to enclose the channel.

5. The method of claim 1, wherein the sign member comprises a plurality of flat surfaces and at least one curved surface.

6. The method of claim 5, wherein the sign member comprises a metal portion, and comprising adhering the LED modules onto the metal portion of the sign member.

7. The method of claim 1, wherein the adhesive member is attached directly to the heat conductive body.

8. The method of claim 7, wherein the adhesive on the body is adhered directly to a surface of the sign member.

9. The method of claim 1, wherein the LED modules are arranged in a dispenser, and additionally comprising drawing successive modules from the dispenser and adhering them into place on the sign member.

10. The method of claim 9, wherein the adhesive portion comprises a tape having a backing, and adhering the adhesive portion to a surface comprises removing the backing and placing the module on the surface.

11. The method of claim 1, wherein contacts are arranged only on the first side of the dielectric layer.

12. The method of claim 11, wherein the heat conductive body comprises a metal.

13. The method of claim 12, wherein the heat conductive body has a unitary structure.

14. The method of claim 12, wherein the heat conductive body comprises a circuit board.

15. The method of claim 1, wherein at least two of the plurality of electrically conductive contacts of the LED modules extend longitudinally and generally parallel along a length of the LED module.

16. The method of claim 15 additionally comprising providing first and second electrical connectors communicating with opposing ends of the at least two longitudinally extending contacts on a plurality of the LED modules.

17. The method of claim 16 additionally comprising electrically attaching connectors of adjacent LED modules together to form a chain of LED modules.

18. The method of claim 17, wherein the at least one LED of each LED module is arranged electrically in parallel with the at least one LED of each other LED module that is part of the chain of LED modules.