Method of manufacturing metal cover with blind holes therein

• US 7,387,740 B2
• Filed: 11/07/2005
• Issued: 06/17/2008
• Est. Priority Date: 01/17/2003
• Status: Expired due to Fees

• Current Assignee: FIH (Hong Kong) Limited (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sutech Trading Limited
• Inventors: Lai, Wen-Te
• Primary Examiner(s): Ahmed; Shamim
• Application Number:
  US11/268,950
• Publication Number:
  US 20060049141A1
• Time in Patent Office: 953 Days
• Field of Search: 216/17, 216/32, 216/56, 216/100, 205/199, 219/121.68, 219/121.69, 204/485, 204/499, 298/49, 298/55, 298/56, 298/59
• US Class Current: 216/17
• CPC Class Codes: B44C 1/227 by etching
• CPC Class Codes: C23F 1/02 Local etching
• CPC Class Codes: C25D 11/04 of aluminium or alloys based thereon
• CPC Class Codes: C25D 13/12 characterised by the article coated
• CPC Class Codes: Y10T 29/4916 Simultaneous circuit manufacturing
• CPC Class Codes: Y10T 29/49171 with encapsulating
• CPC Class Codes: Y10T 29/49172 by molding of insulating material
• CPC Class Codes: Y10T 29/49178 by shrinking of cover

Abstract

An exemplary method of manufacturing a metal cover (1) with blind holes (3) therein includes: step (60), preparing a metal substrate; step (62), covering the metal substrate with a protective film formed by electrophoretic deposition; step (64), forming holes in the protective film according to an intended pattern of the blind holes in the metal cover, thus exposing the metal surface through the holes; step (66), etching the metal substrate in the exposed areas to form the blind holes; and step (68), removing a remainder of the protective film from the metal substrate, thereby obtaining the finished metal cover. The method involving etching is relatively low-cost. Additionally, because electrophoretic deposition is used to cover the metal substrate with the protective film, the protective film can be formed on all surfaces of the metal substrate. Thus the method is especially advantageous for manufacturing a metal cover having a three-dimensional shape.

Claims

1. A method of manufacturing a metal cover with blind holes therein, comprising the steps of:

preparing a metal substrate;

stamping the metal substrate into a three-dimensional shape;

covering the metal substrate, after stamping thereof, with an erosion-resistant protective film formed by electrophoretic deposition;

cutting the protective film, controlled by a predetermined pattern procedure, to form holes in the protective film on the metal substrate, thus exposing areas of the metal substrate, the cutting being performed by a cutting machine, the predetermined pattern being programmed in a computer, the cutting machine being controlled by the computer, according to the predetermined pattern;

etching the metal substrate at the exposed areas to form blind holes; and

removing a remainder of the protective film on the metal substrate, thus obtaining the metal cover.

2. The method of manufacturing a metal cover with blind holes therein as claimed in claim 1, wherein the protective film is a cathodic electrophoretic coating formed by cathodic electrophoretic deposition.

3. The method of manufacturing a metal cover with blind holes therein as claimed in claim 2, wherein said cathodic electrophoretic coating is deposited by dipping the metal substrate into a cathodic electrophoretic deposition bath containing amino epoxy resin, and a concentration of the amino epoxy resin in the cathodic electrophoretic deposition bath is in the range from 10 percent to 20 percent by weight.

4. The method of manufacturing a metal cover with blind holes therein as claimed in claim 1, wherein the holes in the protective film are through holes, and are formed using a laser engraving process, the laser engraving process thereby employing a laser as the cutting machine.

5. The method of manufacturing a metal cover with blind holes therein as claimed in claim 4, wherein the predetermined pattern is used for directing a laser beam at the metal substrate according to an intended pattern of blind holes in the metal cover and for directing a laser beam at the metal substrate.

6. The method of manufacturing a metal cover with blind holes therein as claimed in claim 1, wherein the metal substrate is etched in an alkali solution of sodium hydroxide, a concentration of free sodium hydroxide in the solution is in the range from 10 g/L to 100 g/L, and an etching temperature is in the range from 30 degrees Centigrade to 90 degrees Centigrade.

7. The method of manufacturing a metal cover with blind holes therein as claimed in claim 1, wherein the metal substrate is etched in an acid solution.

8. The method of manufacturing a metal cover with blind holes therein as claimed in claim 1, further comprising the step of covering the metal cover with a protective top layer after removing the remainder of the protective film.

9. The method of manufacturing a metal cover with blind holes therein as claimed in claim 8, wherein the protective top layer is an acrylic acid clear paint or a polyurethane clear paint.

10. The method of manufacturing a metal cover with blind holes therein as claimed in claim 1, further comprising the step of applying a colored pattern on the metal cover after removing the remainder of the protective film.

11. The method of manufacturing a metal cover with blind holes therein as claimed in claim 1, further comprising the step of anodizing the metal cover after removing the remainder of the protective film.

12. The method of manufacturing a metal cover with blind holes therein as claimed in claim 11, further comprising the step of coloring the metal cover using electrolytic coloring, dye coloring or integral coloring alter anodization.

20. The method of manufacturing a metal cover with blind holes therein as claimed in claim 1, wherein the electrophoretic deposition is applied by a voltage of a direct current power between about 50V and about 60V and is carried out for about 40 to about 80 minutes so as to form the protective film.

13. A method of manufacturing a metal cover with blind holes therein, comprising the steps of:

preparing a metal substrate;

stamping the metal substrate into a three-dimensional shape;

selectively covering areas of a surface of the metal substrate, after stamping thereof, with a protective mask, the areas being particularly where blind holes are to be formed;

covering remaining portions of the metal substrate with a protective film formed by electrophoretic deposition;

removing the protective mask, thus exposing said areas of the surface of the metal substrate;

etching the metal substrate at the exposed areas to form the blind holes; and

washing the metal substrate using a methylbenzene solvent so as to remove a remainder of the protective film on the metal substrate, thus obtaining the metal cover.

14. The method of manufacturing a metal cover with blind holes therein as claimed in claim 13, wherein the protective film is a coating formed by dipping the metal substrate into a cathodic electrophoretic deposition bath containing amino epoxy resin.

18. The method of manufacturing a metal cover with blind holes therein as claimed in claim 13, wherein a concentration of the amino epoxy resin in the cathodic electrophoretic deposition bath is about in the range from 10 percent to 20 percent by weight, the amino epoxy resin is EED-060 resin.

19. The method of manufacturing a metal cover with blind holes therein as claimed in claim 13, wherein the electrophoretic deposition is applied by a voltage of a direct current power in the approximate range of 50V to 60V and is carried out for about 40 to about 80 minutes so as to form the protective film.

15. A method of manufacturing a metal cover with blind holes therein, consisting essentially the steps of:

preparing a metal substrate;

stamping metal substrate into a three-dimensional shape;

dipping into the metal substrate, after stamping thereof, into a cathodic electrophoretic deposition bath containing amino epoxy resin for forming a protective film;

forming holes in the protective film on the metal substrate, thus exposing areas of the metal substrate, the forming of the holes being achieved by a laser machine burning off the protective film where the holes are formed, the laser machine being controlled by a computer according to a predetermined pattern procedure programmed therein;

etching the metal substrate at the exposed areas to form blind holes; and

washing the metal substrate using a methylbenzene solvent so as to remove a remainder of the protective film on the metal substrate, thus obtaining the metal cover.

16. The method of manufacturing a metal cover with blind holes therein as claimed in claim 15, wherein a concentration of the amino epoxy resin in the cathodic electrophoretic deposition bath is in the approximate range from 10 percent to 20 percent by weight.

17. The method of manufacturing a metal cover with blind holes therein as claimed in claim 15, wherein a thickness of the protective film is about in the range from 6 μ

m to 10 μ

m, and the amino epoxy resin is EED-060 resin.