Methods for packaging image sensitive electronic devices
First Claim
1. A method for assembling at least one package containing an electronic device sensitive to light or other radiation comprising:
- mounting the electronic device on a carrier substrate having at least one conductive trace thereon, the at least one conductive trace having a first end comprising a terminal pad and a second end comprising an attachment pad;
providing at least one electrical interconnection between the electronic device and the first end of the at least one conductive trace;
forming a molded barrier on the carrier substrate, the molded barrier surrounding a central exposed area that contains the electronic device and the at least one electrical interconnection;
positioning a transparent lid over the central exposed area;
monitoring an output of the electronic device during the positioning the transparent lid, the output varying in relation to the positioning of the transparent lid; and
fixing the transparent lid in place when positioned such that the output has a desired value.
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Accused Products
Abstract
The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment. The transfer mold is then filled with molding compound.
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Citations
10 Claims
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1. A method for assembling at least one package containing an electronic device sensitive to light or other radiation comprising:
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mounting the electronic device on a carrier substrate having at least one conductive trace thereon, the at least one conductive trace having a first end comprising a terminal pad and a second end comprising an attachment pad; providing at least one electrical interconnection between the electronic device and the first end of the at least one conductive trace; forming a molded barrier on the carrier substrate, the molded barrier surrounding a central exposed area that contains the electronic device and the at least one electrical interconnection; positioning a transparent lid over the central exposed area; monitoring an output of the electronic device during the positioning the transparent lid, the output varying in relation to the positioning of the transparent lid; and fixing the transparent lid in place when positioned such that the output has a desired value. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification