Trench metal-insulator-metal (MIM) capacitors and method of fabricating same
First Claim
1. A semiconductor device, comprising:
- at least one trench capacitor that comprises a first metallic electrode layer located over interior walls of a trench in a substrate, a dielectric layer located in said trench over the first metallic electrode layer, and a second metallic electrode layer located in said trench over the dielectric layer; and
at least one field effect transistor (FET) located on said substrate, said at least one FET comprising a source region, a drain region, a channel region between the source and drain regions, and a gate electrode over the channel region,wherein the second metallic electrode layer of the trench capacitor is electrically connected to at least one of the source and drain regions of the at least one FET by a metallic region including a metal silicide strap and a non-silicided metal, said non-silicided metal forms a direct contact between the second metallic electrode layer and the metal silicide strap.
7 Assignments
0 Petitions
Accused Products
Abstract
The present invention relates to a semiconductor device that contains a trench metal-insulator-metal (MIM) capacitor and a field effect transistor (FET). The trench MIM capacitor comprises a first metallic electrode layer located over interior walls of a trench in a substrate, a dielectric layer located in the trench over the first metallic electrode layer, and a second metallic electrode layer located in the trench over the dielectric layer. The FET comprises a source region, a drain region, a channel region between the source and drain regions, and a gate electrode over the channel region. The trench MIM capacitor is connected to the FET by a metallic strap. The semiconductor device of the present invention can be fabricated by a process in which the trench MIM capacitor is formed after the FET source/drain region but before the FET source/drain metal silicide contacts, for minimizing metal contamination in the FET.
23 Citations
15 Claims
-
1. A semiconductor device, comprising:
-
at least one trench capacitor that comprises a first metallic electrode layer located over interior walls of a trench in a substrate, a dielectric layer located in said trench over the first metallic electrode layer, and a second metallic electrode layer located in said trench over the dielectric layer; and at least one field effect transistor (FET) located on said substrate, said at least one FET comprising a source region, a drain region, a channel region between the source and drain regions, and a gate electrode over the channel region, wherein the second metallic electrode layer of the trench capacitor is electrically connected to at least one of the source and drain regions of the at least one FET by a metallic region including a metal silicide strap and a non-silicided metal, said non-silicided metal forms a direct contact between the second metallic electrode layer and the metal silicide strap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A method for forming a semiconductor device, comprising:
-
forming at least one field effect transistor (FET) on a substrate, wherein said at least one FET comprises a source region, a drain region, a channel region between the source and drain regions, and a gate electrode over the channel region; forming a capacitor trench in said substrate; forming a first metallic electrode layer over interior walls of the capacitor trench; forming a dielectric layer in said trench over the first metallic electrode layer; forming a second metallic electrode layer in said trench over the dielectric layer; and forming a metal silicide contact layer in the source and drain regions of the at least one FET and a metallic region including a metal silicide strap and a non-silicided metal between the at least one FET and the trench capacitor, wherein the metal silicide strap electrically connects the second metallic electrode layer of the trench capacitor and at least one of the source and drain regions of the at least one FET and said non-silicided metal forms a direct contact between the second metallic electrode layer and the metal silicide strap. - View Dependent Claims (11, 12, 13, 14, 15)
-
Specification