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Hermetically sealed package for optical, electronic, opto-electronic and other devices

  • US 7,388,285 B2
  • Filed: 08/08/2006
  • Issued: 06/17/2008
  • Est. Priority Date: 03/03/2004
  • Status: Expired due to Term
First Claim
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1. A hermetically sealed package comprising:

  • one or more devices on a semiconductor substrate;

    a lid attached to the semiconductor substrate to encapsulate the one or more devices such that the one or more devices are hermetically sealed within an area defined by the substrate and the lid;

    wherein the lid includes;

    a region containing a substance;

    a wall separating the region containing the substance from the one or more devices, wherein the wall has an opening through which the substance can pass to the one or more devices.

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