Wiring substrate and bonding pad composition

• US 7,388,296 B2
• Filed: 06/08/2006
• Issued: 06/17/2008
• Est. Priority Date: 06/09/2005
• Status: Expired due to Fees

• Current Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Original Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Inventors: Shiraishi, Mitsuo, Urashima, Kazuhiro, Sumi, Hiroshi, Ikawa, Tatsuharu
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US11/449,107
• Publication Number:
  US 20060280919A1
• Time in Patent Office: 740 Days
• Field of Search: 257/741, 257/772, 257/779, 174/257, 174/259, 174/267
• US Class Current: 257/779
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49866 characterised by the materials materials of the substrates H01L23/14, of the lead-frames H01L23/49579
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/111 : Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/113 : Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 2201/10318 : Surface mounted metallic pins
• CPC Class Codes: H05K 3/246 : Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
• CPC Class Codes: H05K 3/248 : fired compositions for inorganic substrates
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 3/4061 : for via connections in inorganic insulating substrates
• CPC Class Codes: Y10T 428/24917 : including metal layer
• CPC Class Codes: Y10T 428/24926 : including ceramic, glass, porcelain or quartz layer

Abstract

A wiring substrate comprised of a substrate main body made of glass-ceramic, a pad formed on a surface of the substrate main body and a conductor pin provided in an upright position on the pad. The pad is comprised of a ceramic that is the same as the ceramic constituting the glass-ceramic, Fe converted into Fe₂O₃ and Cu. The Fe₂O₃ comprises 1 to 28 parts by weight with respect to 100 parts by weight of the Cu.

Claims

1. A wiring substrate comprising:

a substrate main body made of a glass-ceramic comprising Al₂O₃ ceramic, and having a front surface and a back surface;

a pad formed on at least one of the front surface and the back surface of said substrate main body; and

a conductor pin provided in an upright position on said pad via solder, wherein said pad is comprised of;

a ceramic that is the same as the Al₂O₃ ceramic of said glass-ceramic;

Fe converted into Fe₂O₃; and

Cu said Fe₂O₃ comprising 1 to 28 parts by weight with respect to 100 parts by weight of said Cu.

2. A wiring substrate according to claim 1, wherein said pad is comprised of:

4 to 22 parts by weight of said ceramic;

1 to 6 parts by weight of said Fe converted into Fe₂O₃; and

100 parts by weight of said Cu.

3. A wiring substrate comprising:

a substrate main body made of a glass-ceramic comprising Al₂O₃ ceramic, and having a front surface and a back surface;

a pad formed on at least one of the front surface and the back surface of said substrate main body;

a surface layer pad formed on the front surface of said pad; and

a conductor pin provided in an upright position on said surface layer pad via solder,

wherein said pad is comprised of a ceramic that is the same as the Al₂O₃ ceramic of said glass-ceramic, Fe converted into Fe₂O₃, and Cu, said Fe₂O₃ comprising 1 to 28 parts by weight with respect to 100 parts by weight of said Cu, and

wherein said surface layer pad is comprised of Cu and Fe, wherein the content of Fe converted into Fe₂O₃ in said surface layer pad is less than the content of Fe converted into Fe₂O₃ in said pad.

4. A wiring substrate according to claim 3, wherein said pad is comprised of:

4 to 22 parts by weight of said ceramic and;

1 to 6 parts by weight of Fe converted into Fe₂O₃; and

100 parts by weight of Cu.

5. A wiring substrate according to claim 3, wherein the content of the ceramic contained in said surface layer pad is less than the content of the ceramic contained in said pad.

6. A wiring substrate according to claim 4, wherein the content of the ceramic contained in said surface layer pad is less than the content of the ceramic contained in said pad.

7. A wiring substrate according to claim 3, wherein said surface layer pad does not contain ceramic.

8. A wiring substrate according to claim 4, wherein said surface layer pad does not contain ceramic.