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Method for an element using two resist layers

  • US 7,388,542 B2
  • Filed: 11/10/2005
  • Issued: 06/17/2008
  • Est. Priority Date: 11/10/2005
  • Status: Expired due to Fees
First Claim
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1. A method of forming an element, comprising:

  • forming a first resist layer on top of a substrate;

    forming a seed layer on top of at least a portion of the first resist layer;

    forming a second resist layer over a portion of the seed layer, a portion of the second resist layer being positioned above a portion of the first resist layer as well as above the portion of the second layer and;

    electroplating a conductive layer over exposed portions of the seed layer; and

    removing the first and second resist;

    wherein after the removing, step the conductive layer includes at least two electrically isolated regions.

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