Support carrier for a disk-drive with integrated heat-sink

• US 7,388,749 B1
• Filed: 01/03/2006
• Issued: 06/17/2008
• Est. Priority Date: 01/03/2006
• Status: Active Grant

• Current Assignee: Emc IP Holding Company LLC (Dell Technologies Inc.)
• Original Assignee: EMC Corporation (Dell Technologies Inc.)
• Inventors: Keefe, Stephen J., King, Joseph P. Jr., Gundogan, C. Ilhan, Beinor, Albert F. Jr., Feroli, Lawrence J.
• Primary Examiner(s): Chervinsky; Boris L
• Application Number:
  US11/324,354
• Time in Patent Office: 896 Days
• Field of Search: None
• US Class Current: 361/679.48
• CPC Class Codes: G11B 33/121 the apparatus comprising a single recording/reproducing device

Abstract

This invention is a support carrier for attaching a smaller format disk drive into a chassis bay sized for receiving a larger disk drive, the support carrier includes a heat-sink surface with pin fins for conducting and removing heat from the smaller disk drive.

Claims

1. A support carrier for attaching a smaller format disk drive into a chassis bay sized for receiving a larger disk drive, the support carrier comprising:

a frame surrounding an area in which a smaller format disk drive can be attached and supported, wherein the frame is sized for being received into bay of a chassis sized for a larger format disk drive;

a planer surface inside the area in which the smaller format disk drive can be attached for supporting the smaller disk drive;

a heat-sink surface disposed adjacently opposite of and attached to the planer surface for conducting heat from the smaller format disk drive;

pin fins protruding from the surface for further conducting and removing heat from the smaller disk drive.

2. The support carrier of claim 1, wherein the pin fins are cylindrical in shape and the surface includes a thermal interface to provide a heat transfer path from the disk drive to the pin fins.

3. The support carrier of claim 2, wherein the pin fins are integrally attached to the heat-sink surface.

4. The support carrier of claim 3, wherein the pins are disposed in a matrix-array fashion along the heat-sink surface.

5. The support carrier of claim 4, wherein the smaller format disk drives are 2.5 inch format disk drives.

6. The support carrier of claim 5, wherein the larger format disk drives are 3.5 inch format disk drive.

7. The support carrier of claim 1, wherein the chassis includes an opening in the frame through which forced air is passed over the pin fins for removing heat from the disk drive.

8. The support carrier of claim 7, wherein the pin fins are cylindrical in shape.

9. The support carrier of claim 8, wherein the pin fins are integrally attached to the heat-sink surface.

10. The support carrier of claim 9, wherein the pins are disposed in a matrix-array fashion along the heat-sink surface.

11. The support carrier of claim 10, wherein the smaller format disk drives are 2.5 inch format disk drives.

12. The support carrier of claim 11, wherein the larger format disk drives are 3.5 inch format disk drive.

13. A support carrier for attaching a smaller format disk drive into a chassis bay sized for receiving a larger disk drive, the support carrier comprising:

a frame surrounding an area in which a smaller format disk drive can he attached and supported, wherein the frame is sized for being received into bay of a chassis sized for a larger format disk drive;

a planer surface inside the area in which the smaller format disk drive can be attached for supporting the smaller disk drive;

a heat-sink surface disposed adjacently opposite of and attached to the planer surface for conducting heat from the smaller format disk drive;

pin fins protruding from the surface for further conducting and removing heat from the smaller disk drive, wherein the chassis includes an opening in the frame through which forced air is passed over the pin fins for removing heat from the disk drive, wherein the pin fins are cylindrical in shape, wherein the pin fins are integrally attached to the heat-sink surface, wherein the pins are disposed in a matrix-array fashion along the heat-sink surface.

14. The support carrier of claim 13, wherein the smaller format disk drives are 2.5 inch format disk drives.

15. The support carrier of claim 14, wherein the larger format disk drives are 3.5 inch format disk drive.

16. An apparatus for attaching a smaller format disk drive into a chassis bay sized for receiving a larger disk drive, the support carrier comprising:

frame means surrounding an area in which a smaller format disk drive can be attached and supported, wherein the frame means are sized for being received into a drive bay of a chassis sized for a larger format disk drive;

planer surface means inside the area in which the smaller format disk drive can be attached for supporting the smaller disk drive;

heat-sink surface means disposed adjacently opposite of and attached to the planer surface for conducting heat from the smaller format disk drive;

pin fins means protruding from the surface for further conducting and removing heat from the smaller disk drive.

17. The apparatus of claim 16, wherein the pin fins are cylindrical in shape and the heat-sink surface includes a thermal interface to provide a heat transfer path from the disk drive to the pin fins.

18. The apparatus of claim 17, wherein the pin fins are integrally attached to the heat-sink surface.

19. A method of manufacturing a support carrier for attaching a smaller format disk drive into a chassis bay sized for receiving a larger disk drive, the method comprising the steps of:

providing a frame surrounding an area in which a smaller format disk drive can be attached and supported, wherein the frame is sized for being received into bay of a chassis sized for a larger format disk drive;

providing a planer surface inside the area in which the smaller format disk drive can be attached for supporting the smaller disk drive;

providing a heat-sink surface disposed adjacently opposite of and attached to the planer surface for conducting heat from the smaller format disk drive; and

providing pin fins protruding from the surface for further conducting and removing heat from the smaller disk drive.