Method and system for angled RF connection using a flexible substrate

• US 7,388,756 B1
• Filed: 12/12/2006
• Issued: 06/17/2008
• Est. Priority Date: 12/12/2006
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Navarro, Julio A., Takeuchi, Jimmy S., Raby, Scott A., Heisen, Peter T., Worl, Robert T., Pietila, Douglas A., Blaser, Bruce L.
• Primary Examiner(s): Dinh; Tuan T.
• Assistant Examiner(s): Aychillhum; Andargie M
• Application Number:
  US11/609,806
• Publication Number:
  US 20080137317A1
• Time in Patent Office: 553 Days
• Field of Search: 361/681, 361/760, 361/784, 235/439, 257/728, 257/659
• US Class Current: 361/760
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H01R 12/62 connecting to rigid printed circuits or like structures
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 2201/09081 Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
• CPC Class Codes: H05K 2201/09109 Locally detached layers, e.g. in multilayer
• CPC Class Codes: H05K 2201/09318 Core having one signal plane and one power plane
• CPC Class Codes: H05K 2203/049 Wire bonding
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/4691 Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Abstract

A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.

Claims

1. A method for producing an angled RF connection between a first element and a second element using a flexible substrate, comprising:

Creating a void area in a first surface of the first element;

Laminating a flexible substrate onto the first surface of the first element,

flexible substrate including a tab overlying the void area; and

at least partially covering the first surface of the first element bending the tab such that a bonding pad on the tab is in a plane as coincident with or substantially parallel to a plane occupied by a bonding pad on the second element; and

creating the angled RF connection by wire bonding the bonding pad on the flexible substrate tab and the bonding pad on the second element.

2. The method of claim 1, wherein the first element is an antenna integrated printed wiring board.

3. The method of claim 1, wherein the second element is a chip carrier.

4. The method of claim 1, wherein wire bonding is performed by a commercial automated wire bonding machine.

5. The method of claim 1, wherein the flexible substrate includes at least one metal layer.

6. The method claim 1, wherein at least two metal layers form a micro-strip in the flexible substrate.

7. The method of claim 1, wherein the step of creating the void area comprises routing the first surface of the first element.

8. a structure for an angled RF connection, comprising:

A first element including a void area in a first surface thereof;

A second element including a bonding pad; and

A flexible substrate integral with the first element as an outer layer at least

Partially covering the first surface of the first element, the flexible substrate including a tab overlying the void area and having at least one bonding pad positioned on the tab; and

Wire bond electrically connecting the bonding pad on the tab and the bonding pad on the second element;

Wherein the tab is configured to bend in an angle that places the bonding pad on the tab in a plane coincident with or substantially parallel to a plane occupied by the bonding pad on the second element.

9. The structure of claim 8, wherein the first element is an antenna integrated printed wiring board.

10. The structure of claim 8, wherein the second element is a chip carrier.

11. The structure of claim 8, wherein the flexible substrate includes at least one metal layer.

12. The structure of claim 8, wherein metal layers form a micro-strip in the flexible substrate.

13. The structure of claim 8, wherein the wire bond is created by a commercial automated wire bonding machine.

14. The structure of claim 8, wherein the void area is created by routing the first surface of the first element.