Proximity meniscus manifold
First Claim
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1. An apparatus for processing a substrate, comprising:
- a first manifold module configured to define and contain a fluid meniscus between a manifold module surface and a substrate surface;
a second manifold module being configured to connect with the first manifold module and to move the first manifold module into proximity to the substrate surface to generate the fluid meniscus; and
a manifold carrier for positioning the first manifold module to a region of the substrate to be processed;
wherein a processing surface of the first manifold module is defined beyond a plane of a bottom surface of the manifold carrier, and a processing surface of the first manifold module comprises a first conduit for applying a first fluid to the substrate surface, a second conduit for applying a second fluid to the substrate surface, and a third conduit for removing the first fluid and the second fluid from the substrate surface, the proximity of the first manifold defined to contain the fluid meniscus between the manifold module surface and the substrate surface.
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Abstract
An apparatus for processing a substrate is provided which includes a first manifold module to generate a fluid meniscus on a substrate surface. The apparatus also includes a second manifold module to connect with the first manifold module and also to move the first manifold module into close proximity to the substrate surface to generate the fluid meniscus.
114 Citations
10 Claims
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1. An apparatus for processing a substrate, comprising:
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a first manifold module configured to define and contain a fluid meniscus between a manifold module surface and a substrate surface; a second manifold module being configured to connect with the first manifold module and to move the first manifold module into proximity to the substrate surface to generate the fluid meniscus; and a manifold carrier for positioning the first manifold module to a region of the substrate to be processed; wherein a processing surface of the first manifold module is defined beyond a plane of a bottom surface of the manifold carrier, and a processing surface of the first manifold module comprises a first conduit for applying a first fluid to the substrate surface, a second conduit for applying a second fluid to the substrate surface, and a third conduit for removing the first fluid and the second fluid from the substrate surface, the proximity of the first manifold defined to contain the fluid meniscus between the manifold module surface and the substrate surface. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An apparatus for processing a substrate, comprising:
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a first manifold module having a processing face with a first conduit configured to apply a first fluid to a substrate surface, a second conduit for applying a second fluid to the substrate surface, and a third conduit for removing the first fluid and the second fluid from the substrate surface, the applying and the removing defining a fluid meniscus contained between the processing face and the substrate surface; and a second manifold module being configured to move the processing face of the first manifold module proximate to the substrate surface and to deliver the first fluid and the second fluid to the first manifold module and to remove the first fluid and the second fluid that has been applied to the substrate from the first manifold module; a manifold carrier for positioning the first manifold module to a region of the substrate to be processed, where a processing surface of the first manifold module is positioned beyond a plane of a bottom surface of the manifold carrier. - View Dependent Claims (8, 9, 10)
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Specification