Compound connector for two different types of electronic packages
First Claim
Patent Images
1. A compound connector device, comprising:
- a first storage space that is configured to receive a first type of I/O electronic package that has contacts on an edge thereof;
a second storage space coextensive with the first storage space along a major portion thereof, the second storage space being configured to receive a second type of I/O electronic package that is different from the first type of I/O electronic package, the second type of I/O electronic package having two major surfaces and contacts located on one of the two major surfaces; and
a printed circuit board overlaying the second storage space, the printed circuit board including a plurality of contact terminals thereon and defining an opening, at least one of the contact terminals comprising a first end mounted directly on the printed circuit board and a second end cantilevered on the printed circuit board, the second end being adapted to extend through the opening and engage the contacts located on one of the two major surfaces of the second type of I/O electronic package.
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Abstract
A compound connector that comprises two types of I/O connectors, one of which I/O connectors may be a smart connector for use with an external electronic system. The compound connector has a first storage space for receiving a first type of I/O electronic package which includes contacts positioned on its edge. The compound connector has a second storage space for receiving a second type of I/O electronic package which includes contacts positioned on one of its major surfaces.
42 Citations
14 Claims
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1. A compound connector device, comprising:
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a first storage space that is configured to receive a first type of I/O electronic package that has contacts on an edge thereof; a second storage space coextensive with the first storage space along a major portion thereof, the second storage space being configured to receive a second type of I/O electronic package that is different from the first type of I/O electronic package, the second type of I/O electronic package having two major surfaces and contacts located on one of the two major surfaces; and a printed circuit board overlaying the second storage space, the printed circuit board including a plurality of contact terminals thereon and defining an opening, at least one of the contact terminals comprising a first end mounted directly on the printed circuit board and a second end cantilevered on the printed circuit board, the second end being adapted to extend through the opening and engage the contacts located on one of the two major surfaces of the second type of I/O electronic package. - View Dependent Claims (2, 3, 4, 5)
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6. A compound connector device, comprising:
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a first storage space that is configured to receive a first type of I/O electronic package; a second storage space adjacent the first storage space, the second connector being configured to receive a second type of I/O electronic package that is different from the first type of I/O electronic package; a printed circuit board overlaying the second storage space, the printed circuit board including a plurality of contact terminals thereon and defining an opening, at least one of the contact terminals comprising a first end mounted directly on the printed circuit board and a second end cantilevered on the printed circuit board, the second end being adapted to extend through the opening and engage; and a sensor located proximate to the second storage space for facilitating proper alignment of the second type of I/O electronic package with the plurality of contact terminals. - View Dependent Claims (7, 8, 9)
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10. A compound connector device, comprising:
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a first storage space that is configured to receive a first type of I/O electronic package that has contacts on an edge thereof; a second storage space configured to receive a second type of I/O electronic package that is different from the first type of I/O electronic package, the second type of I/O electronic package having two major surfaces and contacts located on one of the two major surfaces; and a printed circuit board overlaying the second storage space, the printed circuit board including a plurality of contact terminals thereon for engaging the contacts located on one of the two major surfaces of the second type of I/O electronic package, the contact terminals being mounted on a surface of the printed circuit board that faces away from the second storage space. - View Dependent Claims (11, 12, 13, 14)
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Specification