Anti-microbial electrosurgical electrode and method of manufacturing same

• US 7,390,326 B2
• Filed: 12/22/2006
• Issued: 06/24/2008
• Est. Priority Date: 12/12/2002
• Status: Expired due to Term

• Current Assignee: Innovatech, LLC
• Original Assignee: Orion Industries Incorporated
• Inventors: Nesbitt, Bruce
• Primary Examiner(s): Cohen; Lee S
• Application Number:
  US11/615,380
• Publication Number:
  US 20070106294A1
• Time in Patent Office: 550 Days
• Field of Search: None
• US Class Current: 606/45
• CPC Class Codes: A47J 36/025 Vessels with non-stick features, e.g. coatings
• CPC Class Codes: A61B 18/14 Probes or electrodes therefor
• CPC Class Codes: A61B 18/1402 Probes for open surgery
• CPC Class Codes: A61B 2018/0013 non-sticking
• CPC Class Codes: A61B 2018/00148 with metal
• CPC Class Codes: A61L 2300/104 Silver, e.g. silver sulfadiazine
• CPC Class Codes: A61L 2300/404 Biocides, antimicrobial agents, antiseptic agents
• CPC Class Codes: A61L 2420/02 Methods for coating medical devices
• CPC Class Codes: A61L 2420/08 Coatings comprising two or more layers
• CPC Class Codes: A61L 31/10 Macromolecular materials
• CPC Class Codes: A61L 31/16 Biologically active materials, e.g. therapeutic substances A61L31/047 takes precedence
• CPC Class Codes: B05D 2601/20 used for non-pigmentation effect
• CPC Class Codes: B05D 3/0281 with induction heating
• CPC Class Codes: B05D 3/20 by magnetic fields
• CPC Class Codes: B05D 5/00 Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
• CPC Class Codes: B05D 5/02 to obtain a matt or rough surface
• CPC Class Codes: B05D 5/06 to obtain multicolour or other optical effects B05D5/02 takes precedence
• CPC Class Codes: B05D 5/08 to obtain an anti-friction or anti-adhesive surface rendering particulate materials free-flowing in general, e.g. making them hydrophobic B01J2/30
• CPC Class Codes: B05D 5/083 involving the use of fluoropolymers
• CPC Class Codes: B05D 7/52 Two layers
• CPC Class Codes: B05D 7/54 : No clear coat specified
• CPC Class Codes: B65G 2249/02 : Controlled or contamination-free environments or clean space conditions
• CPC Class Codes: B65G 49/064 : in a horizontal position B65G49/066 takes precedence
• CPC Class Codes: C03B 35/14 : Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
• CPC Class Codes: F16C 33/201 : Composition of the plastic
• CPC Class Codes: Y10T 428/24372 : Particulate matter
• CPC Class Codes: Y10T 428/2438 : Coated
• CPC Class Codes: Y10T 428/24413 : Metal or metal compound
• CPC Class Codes: Y10T 428/254 : Polymeric or resinous material
• CPC Class Codes: Y10T 428/31725 : Of polyamide
• CPC Class Codes: Y10T 428/32 : Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer

Abstract

An electrosurgical device including a reinforcing underlayment having a non-stick, anti-microbial coating. In one embodiment, the coating includes a non-stick material having anti-microbial particles interspersed in the non-stick material. This coating is applied to the surfaces of the electrode to minimize the build-up of charred tissue on the surfaces of the electrode. Also, the coating tends to kill harmful organisms residing on the surfaces of the electrode. In another embodiment, a primer coating is initially applied to the surfaces of the electrode. A plurality of anti-microbial particles are then applied to the primer coating layer and engage and are embedded in the primer coating layer. A top coat including a non-stick material is applied to the anti-microbial particle layer. In either embodiment, the coating layers applied to the surfaces of the electrode are cured to harden and adhere the layers to the electrode.

Claims

1. An electrosurgical electrode connectible to a handle, said electrosurgical electrode comprising:

a conductive substrate;

at least one substantially uniform coating applied to said substrate, wherein the coating includes a cured base material having a plurality of anti-microbial particles interspersed in said base material, wherein said anti-microbial particles are at least partially electrostatically bonded to said base material and are formulated to kill a microbial organism independent of any energy source; and

a top coating applied to the substantially uniform coating.

2. The electrosurgical electrode of claim 1, wherein the conductive substrate includes a metal.

3. The electrosurgical electrode of claim 2, wherein the metal includes stainless steel.

4. The electrosurgical electrode of claim 1, which includes an electrically insulative material applied to at least a portion of a surface of the conductive substrate.

5. The electrosurgical electrode of claim 4, wherein a portion of the conductive substrate underneath the electrically insulative material includes the substantially uniform coating.

6. The electrosurgical electrode of claim 1, wherein the top coating includes a non-stick material.

7. The electrosurgical electrode of claim 6, wherein the non-stick material includes at least one of the non-stick materials selected from the group consisting of:

a silicone, a polytetrafluoroethylene, a fluoropolymer, a ceramic and a combination of fluorosilicones.

8. The electrosurgical electrode of claim 1, wherein the top coating includes at least one of the following powdered coatings selected from the group consisting of:

polytetrafluoroethylene, perfluoroalkoxy, tetrafluoroethylene perfluoromethyl vinyl ether copolymer and fluoronated ethylene propylene.

9. The electrosurgical electrode of claim 1, wherein the anti-microbial particles include at least one of the group consisting of:

silver particles, ceramic particles and a combination of silver and ceramic particles.

10. The electrosurgical electrode of claim 1, wherein the anti-microbial particles includes silver particles.

11. The electrosurgical electrode of claim 10, wherein a first quantity of anti-microbial particles in the substantially uniform coating is formulated to conduct electricity a first amount and a second, greater quantity of anti-microbial particles in the substantially uniform coating is formulated to conduct electricity a second, greater amount.

12. The electrosurgical electrode of claim 10, wherein a first density of anti-microbial particles applied to a surface of the substrate is formulated to conduct electricity a first amount and a second, greater density of anti-microbial particles applied to the surface of the substrate is formulated to conduct electricity a second, greater amount.

13. The electrosurgical electrode of claim 1, wherein at least part of the conductive substrate forms a shape selected from the group consisting of:

a blade, a scalpel, a needle, a probe, a knife, a wire and a ball.

14. The electrosurgical electrode of claim 1, wherein the base material is electrostatically grounded.

15. The electrosurgical electrode of claim 1, wherein the anti-microbial particles are electrostatically charged.

16. The electrosurgical electrode of claim 1, which includes a plurality of different sized anti-microbial particles.

17. The electrosurgical electrode of claim 1, wherein at least one of the anti-microbial particles is a shape selected from the group consisting of:

flat-shaped, flake-shaped, angular-shaped, cylindrical-shaped, oblong-shaped and leaf-shaped particles.

18. The electrosurgical electrode of claim 1, wherein a portion of the anti-microbial particles are exposed at a surface of the conductive substrate.

19. The electrosurgical electrode of claim 1, wherein a portion of each of a plurality of the anti-microbial particles protrude from the top coating.

20. The electrosurgical electrode of claim 1, wherein a portion of each of a plurality of the anti-microbial particles protrude from the substantially uniform coating.

21. An electrosurgical device including an electrode, a handle connected to the electrode and an electrical source in communication with the handle to transfer electrical energy to the electrode for contacting tissue in a body during an electrosurgical procedure, said electrode comprising:

a conductive substrate;

a wet bonding material applied to the surface of the substrate;

a single layer of substantially uniform anti-microbial particles applied to the wet bonding material, wherein said anti-microbial particles are at least partially electrostatically bonded to the wet bonding material and are formulated to kill a microbial organism independent of any energy source; and

a top coating applied to the layer of anti-microbial particles, wherein a portion of the anti-microbial particles are exposed at the surface of the conductive substrate.

22. The electrosurgical device of claim 21, wherein the conductive substrate includes a metal.

23. The electrosurgical device of claim 22, wherein the metal includes stainless steel.

24. The electrosurgical device of claim 21, which includes an electrically insulative material applied to at least a portion of a surface of the conductive substrate.

25. The electrosurgical device of claim 22, wherein a portion of the conductive substrate underneath the electrically insulative material includes the layer of substantially uniform anti-microbial particles.

26. The electrosurgical device of claim 21, wherein the top coating includes a non-stick material.

27. The electrosurgical device of claim 26, wherein the non-stick material includes at least one of the non-stick materials selected from the group consisting of:

a silicone, a polytetrafluoroethylene, a fluoropolymer, a ceramic and a combination of fluorosilicones.

28. The electrosurgical device of claim 21, wherein the top coating includes at least one of the following powdered coatings selected from the group consisting of:

polytetrafluoroethylene, perfluoroalkoxy, tetrafluoroethylene perfluoromethyl vinyl ether copolymer and fluoronated ethylene propylene.

29. The electrosurgical device of claim 21, wherein the anti-microbial particles include at least one of the group consisting of:

silver particles, ceramic particles and a combination of silver and ceramic particles.

30. The electrosurgical device of claim 21, wherein at least part of the conductive substrate forms a shape selected from the group consisting of:

a blade, a scalpel, a needle, a probe, a knife, a wire and a ball.

31. The electrosurgical device of claim 21, which includes a plurality of different sized anti-microbial particles.

32. The electrosurgical device of claim 21, wherein at least one of the anti-microbial particles is a shape selected from the group consisting of:

flat-shaped, flake-shaped, angular-shaped, cylindrical-shaped, oblong-shaped and leaf-shaped particles.

33. A method of coating an electrosurgical device including a conductive substrate, said method comprising:

(a) applying a substantially uniform coating to a surface of the conductive substrate, said coating including a base material having a plurality of anti-microbial particles interspersed in said base material, wherein said anti-microbial particles are at least partially electrostatically bonded to the base material and are formulated to kill a microbial organism independent of any energy source;

(b) at least partially curing the base material and the anti-microbial particles interspersed in the base material; and

(c) applying a top coating to the base material and the anti-microbial particles interspersed in the base material.

34. The method of claim 33, which includes repeating (a) to (b) until a desired thickness is achieved.

35. The method of claim 33, wherein the anti-microbial particles include at least one of the group consisting of:

silver particles, ceramic particles and a combination of silver and ceramic particles.

36. The method of claim 33, which includes applying an electrically insulative material to at least a portion of the surface of the conductive substrate.

37. The method of claim 36, which includes applying the substantially uniform coating to a portion of the surface of the conductive substrate which is underneath the insulative material.

38. The method of claim 33, which includes applying a wet bonding material to the surface of the conductive substrate prior to applying the substantially uniform coating to the surface of the conductive substrate.

39. The method of claim 38, wherein the wet bonding material includes a primer.

40. The method of claim 33, wherein the top coating includes a non-stick material.

41. The method of claim 40, wherein the non-stick material includes at least one of the non-stick materials selected from the group consisting of:

a silicone, a polytetrafluoroethylene, a fluoropolymer, a ceramic and a combination of fluorosilicones.

42. The method of claim 33, wherein the top coating includes at least one of the following powdered coatings selected from the group consisting of:

polytetrafluoroethylene, perfluoroalkoxy, tetrafluoroethylene perfluoromethyl vinyl ether copolymer and fluoronated ethylene propylene.

43. The method of claim 33, which includes removing at least a portion of the top coating to expose a portion of the anti-microbial particles at the surface of the conductive substrate.

44. The method of claim 33, wherein the base material is electrostatically grounded.

45. The method of claim 33, wherein the anti-microbial particles are electrostatically charged.

46. The method of claim 33, which includes a plurality of different sized anti-microbial particles.

47. The method of claim 33, wherein at least one of the anti-microbial particles is a shape selected from the group consisting of:

flat-shaped, flake-shaped, angular-shaped, cylindrical-shaped, oblong-shaped and leaf-shaped particles.

48. The method of claim 33, wherein applying the substantially uniform coating to the surface of the conductive substrate includes applying powdered anti-microbial particles.

49. The method of claim 33, which includes removing at least a portion of the top coating to expose a portion of each of a plurality of the anti-microbial particles protruding from the top coating.

50. The method of claim 33, which includes removing at least a portion of the top coating to expose a portion of each of a plurality of the anti-microbial particles protruding from the substantially uniform coating.

51. The method of claim 33, which includes grit-blasting the surface of the conductive substrate prior to applying the substantially uniform coating.

52. The method of claim 33, which includes applying a coating of anti-microbial particles to the applied substantially uniform coating prior to at least partially curing the base material and the anti-microbial particles interspersed in the base material.

53. A method of coating an electrosurgical device including a conductive substrate, said method comprising:

(a) applying a wet bonding material to at least a portion of a surface of the conductive substrate;

(b) evenly applying a single layer of substantially uniform anti-microbial particles to the wet bonding material, wherein said anti-microbial particles are at least partially electrostatically bonded to the wet bonding material and are formulated to kill a microbial organism independent of any energy source;

(c) at least partially curing the wet bonding material and the substantially uniform anti-microbial particles; and

(d) partially applying a top coating to the bonding material and the anti-microbial particles such that a portion of the anti-microbial particles are exposed at the surface of the conductive substrate.

54. The method of claim 53, which includes repeating (a) to (c) until a desired thickness is achieved.

55. The method of claim 53, wherein the anti-microbial particles include at least one of the group consisting of:

silver particles, ceramic particles and a combination of silver and ceramic particles.

56. The method of claim 53, which includes applying an electrically insulative material to at least a portion of the surface of the conductive substrate.

57. The method of claim 56, which includes applying the substantially uniform coating to a portion of the surface of the conductive substrate which is underneath the insulative material.

58. The method of claim 53, wherein the wet bonding material includes a primer.

59. The method of claim 53, wherein the top coating includes a non-stick material.

60. The method of claim 59, wherein the non-stick material includes at least one of the non-stick materials selected from the group consisting of:

a silicone, a polytetrafluoroethylene, a fluoropolymer, a ceramic and a combination of fluorosilicones.

61. The method of claim 53, wherein the top coating includes at least one of the following powdered coatings selected from the group consisting of:

polytetrafluoroethylene, perfluoroalkoxy, tetrafluoroethylene perfluoromethyl vinyl ether copolymer and fluoronated ethylene propylene.

62. The method of claim 53, wherein applying a single layer of substantially uniform anti-microbial particles to the wet bonding material includes applying powdered anti-microbial particles.

63. The method of claim 53, wherein applying the wet bonding material to the surface of the conductive substrate includes selectively coating specific portions of the surface of the substrate.

64. The method of claim 53, which includes grit-blasting at least a portion of the surface of the conductive substrate prior to applying the wet bonding material.

65. The method of claim 53, which includes repeating (b) until a desired thickness is achieved.

66. An electrosurgical electrode connectible to a handle, said electrosurgical electrode comprising:

a conductive substrate;

a wet bonding material applied to the surface of the substrate;

a layer of substantially uniform anti-microbial particles applied to the wet bonding material, wherein said anti-microbial particles are at least partially electrostatically bonded to the wet bonding material and are formulated to kill a microbial organism independent of any energy source; and

a top coating at least partially applied to the layer of anti-microbial particles, wherein a portion of each of a plurality of the anti-microbial particles protrude from the top coating.

67. The electrosurgical electrode of claim 66, wherein the conductive substrate includes a metal.

68. The electrosurgical electrode of claim 66, wherein the metal includes stainless steel.

69. The electrosurgical electrode of claim 66, which includes an electrically insulative material applied to at least a portion of a surface of the conductive substrate.

70. The electrosurgical electrode of claim 69, wherein a portion of the conductive substrate underneath the electrically insulative material includes the layer of substantially uniform anti-microbial particles.

71. The electrosurgical electrode of claim 66, wherein the top coating includes a non-stick material.

72. The electrosurgical electrode of claim 71, wherein the non-stick material includes at least one of the non-stick materials selected from the group consisting of:

a silicone, a polytetrafluoroethylene, a fluoropolymer, a ceramic and a combination of fluorosilicones.

73. The electrosurgical electrode of claim 66, wherein the top coating includes at least one of the following powdered coatings selected from the group consisting of:

polytetrafluoroethylene, perfluoroalkoxy, tetrafluoroethylene perfluoromethyl vinyl ether copolymer and fluoronated ethylene propylene.

74. The electrosurgical electrode of claim 66, wherein the anti-microbial particles include at least one of the group consisting of:

silver particles, ceramic particles and a combination of silver and ceramic particles.

75. The electrosurgical electrode of claim 66, wherein at least part of the conductive substrate forms a shape selected from the group consisting of:

a blade, a scalpel, a needle, a probe, a knife, a wire and a ball.

76. The electrosurgical electrode of claim 66, which includes a plurality of different sized anti-microbial particles.

77. The electrosurgical electrode of claim 66, wherein at least one of the anti-microbial particles is a shape selected from the group consisting of:

flat-shaped, flake-shaped, angular-shaped, cylindrical-shaped, oblong-shaped and leaf-shaped particles.

78. An electrosurgical electrode connectible to a handle, said electrosurgical electrode comprising:

a conductive substrate;

a wet bonding material applied to the surface of the substrate;

a layer of substantially uniform anti-microbial particles applied to the wet bonding material, wherein said anti-microbial particles are at least partially electrostatically bonded to the wet bonding material and are formulated to kill a microbial organism independent of any energy source; and

a top coating applied to the layer of anti-microbial particles, wherein a portion of each of a plurality of the anti-microbial particles protrude from the wet bonding material.

79. The electrosurgical electrode of claim 78, wherein the conductive substrate includes a metal.

80. The electrosurgical electrode of claim 78, wherein the metal includes stainless steel.

81. The electrosurgical electrode of claim 78, which includes an electrically insulative material applied to at least a portion of a surface of the conductive substrate.

82. The electrosurgical electrode of claim 81, wherein a portion of the conductive substrate underneath the electrically insulative material includes the layer of substantially uniform anti-microbial particles.

83. The electrosurgical electrode of claim 78, wherein the top coating includes a non-stick material.

84. The electrosurgical electrode of claim 83, wherein the non-stick material includes at least one of the non-stick materials selected from the group consisting of:

a silicone, a polytetrafluoroethylene, a fluoropolymer, a ceramic and a combination of fluorosilicones.

85. The electrosurgical electrode of claim 78, wherein the top coating includes at least one of the following powdered coatings selected from the group consisting of:

polytetrafluoroethylene, perfluoroalkoxy, tetrafluoroethylene perfluoromethyl vinyl ether copolymer and fluoronated ethylene propylene.

86. The electrosurgical electrode of claim 78, wherein the anti-microbial particles include at least one of the group consisting of:

silver particles, ceramic particles and a combination of silver and ceramic particles.

87. The electrosurgical electrode of claim 78, wherein at least part of the conductive substrate forms a shape selected from the group consisting of:

a blade, a scalpel, a needle, a probe, a knife, a wire and a ball.

88. The electrosurgical electrode of claim 78, which includes a plurality of different sized anti-microbial particles.

89. The electrosurgical electrode of claim 78, wherein at least one of the anti-microbial particles is a shape selected from the group consisting of:

flat-shaped, flake-shaped, angular-shaped, cylindrical-shaped, oblong-shaped and leaf-shaped particles.

90. A method of coating an electrosurgical device including a conductive substrate, said method comprising:

(a) applying a wet bonding material to at least a portion of a surface of the conductive substrate;

(b) evenly applying a layer of substantially uniform anti-microbial particles to the wet bonding material, wherein said anti-microbial particles are at least partially electrostatically bonded to the wet bonding material and are formulated to kill a microbial organism independent of any energy source;

(c) at least partially curing the wet bonding material and the substantially uniform anti-microbial particles; and

(d) partially applying a top coating to the bonding material and the anti-microbial particles such that a portion of each of a plurality of the anti-microbial particles protrude from the top coating.

91. The method of claim 90, which includes repeating (a) to (c) until a desired thickness is achieved.

92. The method of claim 90, wherein the anti-microbial particles include at least one of the group consisting of:

silver particles, ceramic particles and a combination of silver and ceramic particles.

93. The method of claim 90, which includes applying an electrically insulative material to at least a portion of the surface of the conductive substrate.

94. The method of claim 93, which includes applying the substantially uniform coating to a portion of the surface of the conductive substrate which is underneath the insulative material.

95. The method of claim 90, wherein the wet bonding material includes a primer.

96. The method of claim 90, wherein the top coating includes a non-stick material.

97. The method of claim 96, wherein the non-stick material includes at least one of the non-stick materials selected from the group consisting of:

a silicone, a polytetrafluoroethylene, a fluoropolymer, a ceramic and a combination of fluorosilicones.

98. The method of claim 90, wherein the top coating includes at least one of the following powdered coatings selected from the group consisting of:

polytetrafluoroethylene, perfluoroalkoxy, tetrafluoroethylene perfluoromethyl vinyl ether copolymer and fluoronated ethylene propylene.

99. The method of claim 90, wherein applying a layer of substantially uniform anti-microbial particles to the wet bonding material includes applying powdered anti-microbial particles.

100. The method of claim 90, wherein applying the wet bonding material to the surface of the conductive substrate includes selectively coating specific portions of the surface of the substrate.

101. The method of claim 90, which includes grit-blasting at least a portion of the surface of the conductive substrate prior to applying the wet bonding material.

102. The method of claim 90, which includes repeating (b) until a desired thickness is achieved.

103. A method of coating an electrosurgical device including a conductive substrate, said method comprising:

(a) applying a wet bonding material to at least a portion of a surface of the conductive substrate;

(b) evenly applying a layer of substantially uniform anti-microbial particles to the wet bonding material, wherein said anti-microbial particles are at least partially electrostatically bonded to the wet bonding material and are formulated to kill a microbial organism independent of any energy source;

(c) at least partially curing the wet bonding material and the substantially uniform anti-microbial particles; and

(d) at least partially applying a top coating to the bonding material and the anti-microbial particles such that a portion of each of a plurality of the anti-microbial particles protrude from the wet bonding material.

104. The method of claim 103, which includes repeating (a) to (c) until a desired thickness is achieved.

105. The method of claim 103, wherein the anti-microbial particles include at least one of the group consisting of:

silver particles, ceramic particles and a combination of silver and ceramic particles.

106. The method of claim 103, which includes applying an electrically insulative material to at least a portion of the surface of the conductive substrate.

107. The method of claim 106, which includes applying the substantially uniform coating to a portion of the surface of the conductive substrate which is underneath the insulative material.

108. The method of claim 103, wherein the wet bonding material includes a primer.

109. The method of claim 103, wherein the top coating includes a non-stick material.

110. The method of claim 109, wherein the non-stick material includes at least one of the non-stick materials selected from the group consisting of:

a silicone, a polytetrafluoroethylene, a fluoropolymer, a ceramic and a combination of fluorosilicones.

111. The method of claim 103, wherein the top coating includes at least one of the following powdered coatings selected from the group consisting of:

polytetrafluoroethylene, perfluoroalkoxy, tetrafluoroethylene perfluoromethyl vinyl ether copolymer and fluoronated ethylene propylene.

112. The method of claim 103, wherein applying a layer of substantially uniform anti-microbial particles to the wet bonding material includes applying powdered anti-microbial particles.

113. The method of claim 103, wherein applying the wet bonding material to the surface of the conductive substrate includes selectively coating specific portions of the surface of the substrate.

114. The method of claim 103, which includes grit-blasting at least a portion of the surface of the conductive substrate prior to applying the wet bonding material.

115. The method of claim 103, which includes repeating (b) until a desired thickness is achieved.