Derived metric for monitoring die placement
First Claim
Patent Images
1. A method for monitoring die placement, comprising:
- receiving measurements of an alignment of a semiconductor die mounted in a package by a die packaging tool, the measurements including center offset metrics associated with displacement of a center of the die with respect to an ideal placement of the die;
determining a plurality of corner offset metrics based on the center offset metrics and dimensions of the die;
selecting a maximum one of the corner offset metrics as a die placement metric; and
identifying an out of tolerance condition with the die packaging tool based on the die placement metric.
3 Assignments
0 Petitions
Accused Products
Abstract
A method for monitoring die placement includes receiving measurements of an alignment of a semiconductor die mounted in a package by a die packaging tool. The measurements include center offset metrics associated with displacement of a center of the die. A plurality of corner offset metrics is determined based on the center offset metrics and dimensions of the die. A maximum one of the corner offset metrics is selected as a die placement metric. An out of tolerance condition with the die packaging tool is identified based on the die placement metric.
-
Citations
21 Claims
-
1. A method for monitoring die placement, comprising:
-
receiving measurements of an alignment of a semiconductor die mounted in a package by a die packaging tool, the measurements including center offset metrics associated with displacement of a center of the die with respect to an ideal placement of the die; determining a plurality of corner offset metrics based on the center offset metrics and dimensions of the die; selecting a maximum one of the corner offset metrics as a die placement metric; and identifying an out of tolerance condition with the die packaging tool based on the die placement metric. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A system, comprising:
-
a die placement metrology tool operable to measure an alignment of a semiconductor die at least partially mounted in a package by a die packaging tool to generate center offset metrics associated with displacement of a center of the die with respect to an ideal placement of the die; and a placement monitor operable to determine a plurality of corner offset metrics based on the center offset metrics and dimensions of the die, select a maximum one of the corner offset metrics as a die placement metric, and identify an out of tolerance condition with the die packaging tool based on the die placement metric. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. A system, comprising:
-
means for receiving measurements of an alignment of a semiconductor die at least partially mounted in a package by a die packaging tool, the measurements including center offset metrics associated with displacement of a center of the die with respect to an ideal placement of the die; means for determining a plurality of corner offset metrics based on the center offset metrics and dimensions of the die; means for selecting a maximum one of the corner offset metrics as a die placement metric; and means for identifying an out of tolerance condition with the die packaging tool based on the die placement metric. - View Dependent Claims (20, 21)
-
Specification