Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers

• US 7,390,687 B2
• Filed: 10/31/2006
• Issued: 06/24/2008
• Est. Priority Date: 02/18/2005
• Status: Active Grant

• Current Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Original Assignee: Micron Technology, Inc.
• Inventors: Li, Jin, Boettiger, Ulrich C., Oliver, Steven D.
• Primary Examiner(s): Kebede; Brook
• Application Number:
  US11/589,929
• Publication Number:
  US 20070096235A1
• Time in Patent Office: 602 Days
• Field of Search: 438/64, 438/65, 438/75, 438/116, 438/126, 438/57, 438/69, 257/E27.13, 257/E27.133, 257/E27.141
• US Class Current: 438/64
• CPC Class Codes: H01L 27/14601 Structural or functional details thereof
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/351 Thermal stress

Abstract

Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imaging die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.

Claims

1. A method of manufacturing microelectronic imager devices, comprising:

providing a substrate comprising a front side, a backside, and a plurality of imaging dies arranged in a die pattern, wherein the imaging dies comprise image sensors and integrated circuitry coupled to corresponding image sensors;

providing a mold comprising a plurality of curved molding sites arranged in the die pattern; and

conforming the imaging dies to the curved molding sites to bend the image sensors to a desired curvature.

2. The method of claim 1 wherein:

individual curved molding sites comprise a curved molding surface such that the mold has a plurality of curved molding surfaces corresponding to imaging dies; and

conforming the imaging dies to the curved molding sites comprises locally bending discrete regions of the substrate to conform to the curved molding surfaces.

3. The method of claim 2 wherein the curved molding surfaces comprise depressions in the mold and the substrate flexes into the depressions.

4. The method of claim 2 wherein the curved molding surfaces comprise vacuum cups having an opening and bending discrete regions of the substrate comprises drawing a vacuum in the cups that draws the discrete regions of the substrate against the curved molding surfaces.

5. The method of claim 2, further comprising adhering the discrete regions of the substrate to the curved molding surfaces.

6. The method of claim 1, further comprising cutting the substrate and the mold to separate the imaging dies from each other.

7. The method of claim 1, further comprising forming standoffs on the front side of the substrate, attaching a cover to the standoffs, and separating the imaging dies from each other by cutting the cover, the substrate and the mold.

8. The method of claim 2 wherein the curved molding surfaces are depressions.

9. The method of claim 2 wherein the curved molding surfaces are raised features.