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Enhanced adhesion strength between mold resin and polyimide

  • US 7,390,697 B2
  • Filed: 02/17/2005
  • Issued: 06/24/2008
  • Est. Priority Date: 01/28/2002
  • Status: Expired due to Term
First Claim
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1. A method for applying a stress relief interface layer over a semiconductor surface, comprising the steps of:

  • providing a semiconductor surface;

    forming a stress relief interface layer over said semiconductor surface;

    creating openings through said stress relief interface layer before forming a layer of mold compound; and

    forming the layer of mold compound over a surface of the stress relief interface layer and filling the openings created through the stress relief interface layer.

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