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Light emitting device provided with a submount assembly for improved thermal dissipation

  • US 7,391,153 B2
  • Filed: 07/15/2004
  • Issued: 06/24/2008
  • Est. Priority Date: 07/17/2003
  • Status: Active Grant
First Claim
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1. A light emitting device, comprising:

  • a light emitting element comprising a light emitting layer to emit light with a predetermined wavelength; and

    a sealing portion that seals the light emitting element, the sealing portion comprising a glass,wherein the light emitting element comprises a substrate comprising a stress reducing portion to reduce an internal stress in the sealing portion, the stress reducing portion being formed on an opposite side to a side where the light emitting layer is formed,the light emitting element is flip-chip mounted, andthe stress reducing portion comprises an oblique portion formed between a top surface and a side surface of the substrate, the top surface and the side surface being substantially orthogonal to each other.

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