Capacitance type sensor
First Claim
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1. A capacitance type sensor comprising:
- a substrate;
a group of fixed electrodes provided on an upper face of said substrate;
a movable electrode plate with a lower flat face having an electrode on said lower flat face and a rubber elasticity; and
whereinsaid substrate is provided with a solder layer having a thickness, said solder layer supports said movable electrode plate and said thickness of said solder layer provides a gap between said group of fixed electrodes on said substrate and said electrode on said movable electrode plate, and said elastic movable electrode plate deforms due to force or moment applied thereto and said gap changes accordingly so as to change capacitance thereabout, andsaid solder layer comprises a first solder layer and a second solder layer, said first solder layer being provided to surround said group of fixed electrodes and said second solder layer being located at a center of said group of fixed electrodes.
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Abstract
A capacitance type sensor includes a substrate, a group of electrodes fixed on an upper face of the substrate, a movable electrode plate having an electrode on its lower side and a gap between the group of fixed electrodes on the substrate and the electrode on the movable electrode plate. The gap is formed with a solder layer, a conductive elastomer layer, a conductive paint layer, or a conductive adhesive material layer provided on the substrate. The electrode on the movable electrode plate is made of conductive rubber plate or conductive elastomer plate.
14 Citations
6 Claims
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1. A capacitance type sensor comprising:
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a substrate; a group of fixed electrodes provided on an upper face of said substrate; a movable electrode plate with a lower flat face having an electrode on said lower flat face and a rubber elasticity; and
whereinsaid substrate is provided with a solder layer having a thickness, said solder layer supports said movable electrode plate and said thickness of said solder layer provides a gap between said group of fixed electrodes on said substrate and said electrode on said movable electrode plate, and said elastic movable electrode plate deforms due to force or moment applied thereto and said gap changes accordingly so as to change capacitance thereabout, and said solder layer comprises a first solder layer and a second solder layer, said first solder layer being provided to surround said group of fixed electrodes and said second solder layer being located at a center of said group of fixed electrodes. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification