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System and method for compensating for thermal expansion of lithography apparatus or substrate

  • US 7,391,503 B2
  • Filed: 10/25/2005
  • Issued: 06/24/2008
  • Est. Priority Date: 10/04/2005
  • Status: Expired due to Fees
First Claim
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1. A device manufacturing method comprising:

  • exposing a feature on a substrate, the feature having a boundary, comprising,performing a first exposure by projecting a modulated radiation beam onto the substrate to expose a fine perimeter area the feature within a predetermined distance of the boundary,measuring an expansion of the exposed fine perimeter area; and

    performing a second exposure, based upon the measured expansion by projecting the modulated beam of radiation onto the substrate to expose a coarse inside area of the feature, separate from the fine perimeter area, unexposed during the first exposure.

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