Method for manufacturing an electro-optical device
First Claim
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1. A method of manufacturing a light emitting device comprising:
- forming a thin film transistor over a substrate;
forming a first insulating film comprising an organic resin over the thin film transistor;
forming a second insulating film comprising at least one selected from the group consisting of silicon nitride, aluminum oxide, aluminum nitride, nitrated aluminum oxide and diamond like carbon over the first insulating film;
forming a first electrode electrically connected to the thin film transistor, over the second insulating film, and in contact with the second insulating film so as to cover the first insulating film;
forming a bank covering an edge of the first electrode, over the second insulating film;
forming an EL layer by ink jet method;
forming a second electrode covering the bank and the EL layer; and
forming a third insulating film covering the second electrode,wherein the EL layer is disposed adjacent to a side edge of the bank, and wherein the EL layer does not extend beyond the side edge of the bank.
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Abstract
An object of the present invention is to provide an EL display device having high operation performance and reliability.
A third passivation film 45 is disposed under the EL element 203 comprising a pixel electrode (anode) 46, an EL layer 47 and a cathode 48, and diffusion of alkali metals from the EL element 203 formed by ink jet method into TFTs is prevented. Further, the third passivation film 45 prevents penetration of moisture and oxygen from the TFTs, and suppress degradation of the EL element 203 by dispersing the heat generated by the EL element 203.
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Citations
28 Claims
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1. A method of manufacturing a light emitting device comprising:
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forming a thin film transistor over a substrate; forming a first insulating film comprising an organic resin over the thin film transistor; forming a second insulating film comprising at least one selected from the group consisting of silicon nitride, aluminum oxide, aluminum nitride, nitrated aluminum oxide and diamond like carbon over the first insulating film; forming a first electrode electrically connected to the thin film transistor, over the second insulating film, and in contact with the second insulating film so as to cover the first insulating film; forming a bank covering an edge of the first electrode, over the second insulating film; forming an EL layer by ink jet method; forming a second electrode covering the bank and the EL layer; and forming a third insulating film covering the second electrode, wherein the EL layer is disposed adjacent to a side edge of the bank, and wherein the EL layer does not extend beyond the side edge of the bank. - View Dependent Claims (2, 3, 4)
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5. A method of manufacturing a light emitting device comprising:
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forming a thin film transistor over a substrate; forming a first insulating film comprising an organic resin over the thin film transistor; forming a second insulating film comprising at least one selected from the group consisting of silicon nitride, aluminum oxide, aluminum nitride, nitrated aluminum oxide and diamond like carbon over the first insulating film; forming a first electrode electrically connected to the thin film transistor, over the second insulating film, and in contact with the second insulating film so as to cover the first insulating film; forming a bank covering an edge of the first electrode, over the second insulating film; forming an EL layer by ink jet method; and forming a second electrode covering the bank and the EL layer, wherein the EL layer is disposed adjacent to a side edge of the bank, wherein the EL layer does not extend beyond the side edge of the bank, and wherein the EL layer and the second electrode are formed continuously without exposure to the air. - View Dependent Claims (6, 7)
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8. A method of manufacturing a light emitting device comprising:
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forming a thin film transistor over a substrate; forming a first insulating film comprising an organic resin over the thin film transistor; forming a second insulating film comprising at least one selected from the group consisting of silicon nitride, aluminum oxide, aluminum nitride, nitrated aluminum oxide and diamond like carbon over the first insulating film; forming a first electrode electrically connected to the thin film transistor, over the second insulating film, and in contact with the second insulating film so as to cover the first insulating film; forming a bank covering an edge of the first electrode, aver the second insulating film; forming an EL layer by ink jet method; forming a second electrode covering the bank and the EL layer; and forming a third insulating film covering the second electrode, wherein the EL layer is disposed adjacent to a side edge of the bank, wherein the EL layer does not extend beyond the side edge of the bank, and wherein the EL layer, the second electrode, and the third insulating film are formed continuously without exposure to the air. - View Dependent Claims (9, 10, 11)
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12. A method of manufacturing a light emitting device comprising:
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forming a thin film transistor over a substrate; forming a first insulating film comprising an organic resin over the thin film transistor; forming a second insulating film comprising at least one selected from the group consisting of silicon nitride, aluminum oxide, aluminum nitride, nitrated aluminum oxide and diamond like carbon over the first insulating film; forming a first electrode electrically connected to the thin film transistor, over the second insulating film, and in contact with the second insulating film so as to cover the first insulating film; forming a bank covering an edge of the first electrode, over the second insulating film; forming an EL layer by ink jet method; and forming a second electrode covering the bank and the EL layer; wherein a side surface of the bank is in contact with a side edge of the EL layer. - View Dependent Claims (13, 14)
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15. A method of manufacturing a light emitting device comprising:
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forming a thin film transistor over a substrate; forming a first insulating film comprising an organic resin over the thin film transistor; forming a second insulating film comprising at least one selected from the group consisting of silicon nitride, aluminum oxide, aluminum nitride, nitrated aluminum oxide and diamond like carbon over the first insulating film; forming a first electrode electrically connected to the thin film transistor, over the second insulating film, and in contact with the second insulating film so as to cover the first insulating film; forming a bank covering an edge of the first electrode, over the second insulating film; forming an EL layer by ink jet method; forming a second electrode covering the bank and the EL layer; and forming a third insulating film covering the second electrode, wherein the EL layer comprises at least one selected from the group consisting of a light emitting layer, a hole injecting layer, a hole transporting layer, an electron injecting layer, and an electron transporting layer, over the first electrode, wherein the EL layer is disposed adjacent to a side edge of the bank, and wherein the EL layer does not extend beyond the side edge of the bank. - View Dependent Claims (16, 17, 18)
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19. A method of manufacturing a light emitting device comprising:
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forming a thin film transistor over a substrate; forming a first insulating film comprising an organic resin over the thin film transistor; forming a second insulating film comprising at least one selected from the group consisting of silicon nitride, aluminum oxide, aluminum nitride, nitrated aluminum oxide and diamond like carbon over the first insulating film; forming a first electrode electrically connected to the thin film transistor, over the second insulating film, and in contact with the second insulating film so as to cover the first insulating film; forming a bank covering an edge of the first electrode, over the second insulating film; forming an EL layer by ink jet method; and forming a second electrode covering the bank and the EL layer; wherein the EL layer comprises at least one selected from the group consisting of a light emitting layer, a hole injecting layer, a hole transporting layer, an electron injecting layer, and an electron transporting layer, over the first electrode, wherein the EL layer is disposed adjacent to a side edge of the bank, wherein the EL layer does not extend beyond the side edge of the bank, and wherein the EL layer and the second electrode are formed continuously without exposure to the air. - View Dependent Claims (20, 21)
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22. A method of manufacturing a light emitting device comprising:
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forming a thin film transistor over a substrate; forming a first insulating film comprising an organic resin over the thin film transistor; forming a second insulating film comprising at least one selected from the group consisting of silicon nitride, aluminum oxide, aluminum nitride, nitrated aluminum oxide and diamond like carbon over the first insulating film; forming a first electrode electrically connected to the thin film transistor, over the second insulating film, and in contact with the second insulating film so as to cover the first insulating film; forming a bank covering an edge of the first electrode, over the second insulating film; forming an EL layer by ink jet method; forming a second electrode covering the bank and the EL layer; and forming a third insulating film covering the second electrode, wherein the EL layer comprises at least one selected from the group consisting of a light emitting layer, a hole injecting layer, a hole transporting layer, an electron injecting layer, and an electron transporting layer, over the first electrode, wherein the EL layer is disposed adjacent to a side edge of the bank, wherein the EL layer does not extend beyond the side edge of the bank, and wherein the EL layer, the second electrode, and the third insulating film are formed continuously without exposure to the air. - View Dependent Claims (23, 24, 25)
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26. A method of manufacturing a light emitting device comprising:
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forming a thin film transistor over a substrate; forming a first insulating film comprising an organic resin over the thin film transistor; forming a second insulating film comprising at least one selected from the group consisting of silicon nitride, aluminum oxide, aluminum nitride, nitrated aluminum oxide and diamond like carbon over the first insulating film; forming a first electrode electrically connected to the thin film transistor, over the second insulating film, and in contact with the second insulating film so as to cover the first insulating film; forming a bank covering an edge of the first electrode, over the second insulating film; forming an EL layer by ink jet method; forming a second electrode covering the bank and the EL layer; and wherein the EL layer comprises at least one selected from the group consisting of a light emitting layer, a bole injecting layer, a hole transporting layer, an electron injecting layer, and an electron transporting layer, over the first electrode, wherein a side surface of the bank is in contact with a side edge of the EL layer. - View Dependent Claims (27, 28)
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Specification