Fluidic MEMS device

• US 7,393,712 B2
• Filed: 02/08/2006
• Issued: 07/01/2008
• Est. Priority Date: 07/15/2003
• Status: Expired due to Term

• Current Assignee: Samsung Electronics Co. Ltd. (Samsung Group)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Smith, Mark A., Haluzak, Charles C, Boucher, William R
• Primary Examiner(s): Zarneke; David A
• Application Number:
  US11/350,662
• Publication Number:
  US 20070042565A1
• Time in Patent Office: 874 Days
• Field of Search: 438/51
• US Class Current: 438/51
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound

Abstract

A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities. The cover plate, the substrate and the breaches define a plurality of respective fill ports. The method also includes filling the inner cavities with fluid, sealing the fluid in the inner cavities, and singulating a plurality of MEMS packages from the substrate.

Claims

1. A method of manufacturing a fluidic MEMS package comprising:

attaching a cover plate, with a plurality of openings exposing electrical connections to a plurality of MEMS devices, to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities and the cover plate, the substrate and the breaches define a plurality of respective fill ports;

filling the inner cavities with fluid while preventing the introduction of air an/or gas into the inner cavities;

sealing the fluid in the inner cavities;

singulating a plurality of MEMS packages from the substrate.

2. The method of claim 1, further comprising functional testing, using the electrical connections, the plurality of MEMS device within the fluidic MEMS package prior to singulating the plurality of MEMS packages from the substrate.

3. The method of claim 1, wherein filling the inner cavities with fluid comprises:

providing a vacuum in the inner cavity, providing an amount of fluid sufficient to fill the inner cavity at the fill port and providing pressure on the fluid to cause the fluid to fill the cavity.

4. The method of claim 1, wherein filling the inner cavities with fluid is performed prior to singulating the plurality of MEMS packages from the substrate.

5. The method of claim 1, wherein the bond ring comprises one of a glass frit, adhesive, eutectic solder, solder mask material, anodic bond, covalent bond, laser weld or Sol-gel material.

6. The method of claim 1 wherein attaching a cover plate with a plurality of openings to a substrate comprises:

attaching a plurality of cover plates to a plurality of die locations on the surface of the substrate, the attaching being done with the plurality of respective bond rings, the plurality of openings being the space between the plurality of cover plates thereby exposing the electrical connections.

7. The method of claim 1 wherein filling the inner cavities with fluid comprises:

purging air from the inner cavity using a purge gas;

providing a vacuum in the inner cavity;

at an entrance to the fill port, providing an amount of fluid at least sufficient to fill the inner cavity; and

providing pressure on the fluid causing the fluid to fill the inner cavity.

8. The method of claim 7, wherein the purge gas has high solubility.

9. The method of claim 7, wherein the purge gas is one of carbon dioxide or helium.

10. The method of claim 7, further comprising providing a vacuum environment around the MEMS package.

11. The method of claim 10, wherein providing a vacuum environment comprises placing the MEMS package in a chamber and evacuating air from the chamber.

12. The method of claim 10, wherein providing a vacuum environment comprises assembling the MEMS package in a vacuum environment.

13. The method of claim 7, wherein providing an amount of fluid comprises submerging the MEMS package in fluid.

14. The method of claim 7, wherein providing an amount of fluid comprises touching a fluid carrier with fluid to the fill port.

15. A method of claim 1 wherein filling the inner cavities with fluid comprises:

providing the MEMS package an evacuate port, the fill port and the evacuate port each being defined by the cover plate, the substrate and a respective one of a plurality of breaches in the bond ring;

at an entrance to the fill port, providing an amount of fluid at least sufficient to fill the inner cavity; and

selecting the fluid, substrate, bond ring and cover plate such that capillary forces draw the fluid into the inner cavity causing air within the inner cavity to evacuate through the evacuate port.