Fluidic MEMS device
First Claim
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1. A method of manufacturing a fluidic MEMS package comprising:
- attaching a cover plate, with a plurality of openings exposing electrical connections to a plurality of MEMS devices, to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities and the cover plate, the substrate and the breaches define a plurality of respective fill ports;
filling the inner cavities with fluid while preventing the introduction of air an/or gas into the inner cavities;
sealing the fluid in the inner cavities;
singulating a plurality of MEMS packages from the substrate.
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Abstract
A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities. The cover plate, the substrate and the breaches define a plurality of respective fill ports. The method also includes filling the inner cavities with fluid, sealing the fluid in the inner cavities, and singulating a plurality of MEMS packages from the substrate.
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Citations
15 Claims
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1. A method of manufacturing a fluidic MEMS package comprising:
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attaching a cover plate, with a plurality of openings exposing electrical connections to a plurality of MEMS devices, to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities and the cover plate, the substrate and the breaches define a plurality of respective fill ports; filling the inner cavities with fluid while preventing the introduction of air an/or gas into the inner cavities; sealing the fluid in the inner cavities; singulating a plurality of MEMS packages from the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification