Temperature conditioned load lock, lithographic apparatus comprising such a load lock and method of manufacturing a substrate with such a load lock
First Claim
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1. A load lock for a lithographic apparatus arranged to transfer an object into and from the lithographic apparatus, comprising:
- an outer wall at least partly defining a load lock volume accommodating a support unit constructed and arranged to support said object when in said load lock at a predetermined pressure, said outer wall being constructed and arranged to permit said object to be transferred between said load lock volume and the lithographic apparatus outside said outer wall;
a temperature conditioned structure constructed and arranged to control a temperature of said object to a desired temperature at least before said object is transferred from said load lock towards the lithographic projection apparatus; and
a processor in communication with a pump to depressurize the load lock volume by the pump from a first pressure to a second pressure, the processor also being arranged to control the temperature conditioned structure such that the object is at a predetermined temperature that is higher than said desired temperature when said processor starts depressurizing said load lock volume.
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Abstract
A load lock for a lithographic apparatus is arranged to transfer an object, like a substrate, into and from the lithographic apparatus. The load lock outer wall defining at least part of a load lock volume accommodating a support unit for supporting the object when in the load lock. The load lock also has a temperature conditioned structure to control the temperature of the object to a desired temperature at least before the object is transferred from the load lock towards the lithographic projection apparatus.
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Citations
25 Claims
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1. A load lock for a lithographic apparatus arranged to transfer an object into and from the lithographic apparatus, comprising:
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an outer wall at least partly defining a load lock volume accommodating a support unit constructed and arranged to support said object when in said load lock at a predetermined pressure, said outer wall being constructed and arranged to permit said object to be transferred between said load lock volume and the lithographic apparatus outside said outer wall; a temperature conditioned structure constructed and arranged to control a temperature of said object to a desired temperature at least before said object is transferred from said load lock towards the lithographic projection apparatus; and a processor in communication with a pump to depressurize the load lock volume by the pump from a first pressure to a second pressure, the processor also being arranged to control the temperature conditioned structure such that the object is at a predetermined temperature that is higher than said desired temperature when said processor starts depressurizing said load lock volume. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A load lock for a lithographic apparatus arranged to transfer an object into and from the lithographic apparatus, comprising:
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an outer wall at least partly defining a load lock volume accommodating a support unit constructed and arranged to support said object when in said load lock at a predetermined pressure, said outer wall being constructed and arranged to permit said object to be transferred between said load lock volume and the lithographic apparatus outside said outer walk; and a temperature conditioned structure constructed and arranged to control a temperature of said object to a desired temperature at least before said object is transferred from said load lock towards the lithographic projection apparatus; wherein said support unit is constructed and arranged to substantially protect said object from a gas flow against a surface of said object when said load lock volume is depressurized. - View Dependent Claims (10, 11, 12)
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13. A load lock for a lithographic apparatus arranged to transfer an object into and from the lithographic apparatus, comprising:
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an outer wall at least partly defining a load lock volume accommodating a support unit constructed and arranged to support said object when in said load lock at a predetermined pressure, said outer wall being constructed and arranged to permit said object to be transferred between said load lock volume and the lithographic apparatus outside said outer wall; and a temperature conditioned structure constructed and arranged to control a temperature of said object to a desired temperature at least before said object is transferred from said load lock towards the lithographic projection apparatus; and a processor in communication with a pump to depressurize said load lock volume by said pump to a predetermined first pressure, to wait during a predetermined time period and then to depressurize said load lock volume to a predetermined second pressure.
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14. An assembly in a lithographic apparatus, said assembly comprising:
- a support structure having a body constructed and arranged to support a substrate; and
a volume between said substrate and said support structure,said body of said support structure including a supply line to supply a gas in said volume between said substrate and said support, and said support structure being constructed and arranged to control the temperature of said substrate via said gas in said volume; wherein said support structure comprises a stationary body and is arranged to rotate said body in use within said stationary body, said body and said stationary body defining a gap between them that is in communication with said volume, said stationary body having lines allowing a temperature controlled fluid to flow therethrough. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
- a support structure having a body constructed and arranged to support a substrate; and
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22. A lithographic projection assembly comprising:
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a radiation system constructed to provide a beam of radiation; a patterning device serving to pattern said beam of radiation according to a desired pattern and form a patterned beam; a projection system that projects said patterned beam; and a load lock arranged to transfer an object into and from a lithographic apparatus, said load lock comprising; an outer wall at least partly defining a load lock volume accommodating a support structure constructed and arranged to support the object when in said load lock at a predetermined pressure, said outer wall being constructed and arranged to permit the object to be transferred between said load lock volume and said lithographic apparatus outside said outer wall, said support structure having a body constructed and arranged to support the object and a volume existing between the object and said support structure, said body of said support structure including a supply line to supply a gas in said volume between the object and said support structure, and said support structure being constructed and arranged to control the temperature of the object via said gas in said volume to a desired temperature at least before said object is transferred from said load lock towards the lithographic projection apparatus; and a processor in communication with a pump to depressurize the load lock volume by the pump from a first pressure to a second pressure, the processor also being arranged to control the temperature of the gas such that the object is at a predetermined temperature that is higher than the desired temperature when said processor starts depressurizing said load lock volume. - View Dependent Claims (23, 24)
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25. A method for manufacturing a device comprising:
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providing a substrate that is at least partially covered by a layer of radiation-sensitive material; providing a beam of radiation using a radiation system; patterning the beam with a pattern in its cross-section; and projecting the patterned beam of radiation onto a target portion of the layer of radiation-sensitive material, providing the substrate to a lithographic projection apparatus through a load lock, the load lock having an outer wall at least partly defining a load lock chamber accommodating a support structure supporting the substrate when in the load lock at a predetermined pressure, and controlling the temperature of the substrate via a gas in a volume between the substrate and the support structure such that the substrate is at a desired temperature at least before said substrate is transferred from said load lock towards the lithographic projection; and depressurizing a load lock volume by a pump from a first pressure to a second pressure with a processor, the processor arranged to control the temperature of the gas such that the substrate is at a predetermined temperature that is higher than the desired temperature when the processor starts depressurizing the load lock volume.
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Specification