Electronic component built-in module and method of manufacturing the same

• US 7,394,663 B2
• Filed: 02/09/2004
• Issued: 07/01/2008
• Est. Priority Date: 02/18/2003
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Nakatani, Seiichi, Hirano, Koichi, Asahi, Toshiyuki, Sugaya, Yasuhiro, Yamashita, Yoshihisa
• Primary Examiner(s): Dinh; Tuan T
• Application Number:
  US10/775,656
• Publication Number:
  US 20040160752A1
• Time in Patent Office: 1,604 Days
• Field of Search: 174255-258, 361760-766, 361792-795, 257678-704, 428209-210
• US Class Current: 361/766
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/82047 by mechanical means, e.g. severing, pressing, stamping
• CPC Class Codes: H01L 23/49894 Materials of the insulating layers or coatings
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H05K 1/186 manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 1/187 the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination

Abstract

An electronic component built-in module according to the present invention includes a pair of opposed circuit substrates, each of which includes a wiring pattern and an insulating base material containing a resin, an insulating layer that is placed between the pair of circuit substrates and contains an inorganic filler and a resin composition containing a thermosetting resin, an electronic component that is embedded in the insulating layer, and an inner via that is provided in the insulating layer so as to make an electrical connection between wiring patterns provided on different circuit substrates. A glass transition temperature Tg1 of the resin composition contained in the insulating layer and a glass transition temperature Tg2 of the insulating base material included in each of the circuit substrates satisfy a relationship Tg1>Tg2.

Claims

1. An electronic component built-in module, comprising:

a pair of opposed circuit substrates, in each of which a wiring pattern is formed on an insulating base material containing a resin;

an insulating layer that is placed between the pair of circuit substrates and contains an inorganic filler and a resin composition containing a thermosetting resin;

at least one electronic component that is embedded in the insulating layer; and

an inner via that is provided in the insulating layer so as to make an electrical connection between wiring patterns provided on different circuit substrates,

wherein a glass transition temperature Tg1 of the resin composition contained in the insulating layer and a glass transition temperature Tg2 of the resin of the insulating base material included in each of the circuit substrates satisfy a relationship Tg1>

Tg2,

wherein a difference between the glass transition temperature Tg1 and the glass transition temperature Tg2 is at least 10°

C., and

wherein a rate of increase in amount of thermal expansion in a thickness direction of the insulating layer at a temperature from Tg2 to Tg1 is smaller than a rate of increase in amount of thermal expansion in a thickness direction of the insulating layer at a temperature higher than Tg1.

2. The electronic component built-in module according to claim 1,

wherein a plurality of the insulating layers are provided.

3. The electronic component built-in module according to claim 1,

wherein the insulating layer contains the inorganic filler in an amount of not less than 70% by weight and not more than 95% by weight.

4. The electronic component built-in module according to claim 1,

wherein the inorganic filler contains at least one selected from the group consisting of:

Al₂O₃, MgO, BN, SiO₂, SiC, Si₃N₄, and AlN.

5. The electronic component built-in module according to claim 1,

wherein the thermosetting resin contains at least one selected from the group consisting of:

an epoxy resin, a phenol resin, and an isocyanate resin.

6. The electronic component built-in module according to claim 1,

wherein the at least one electronic component comprises a semiconductor bare chip.

7. The electronic component built-in module according to claim 1,

wherein the inner via is formed from a conductive resin composition.

8. The electronic component built-in module according to claim 1,

wherein the at least one electronic component embedded in the insulating layer is mounted on at least one of the pair of opposed circuit substrates.

9. The electronic component built-in module according to claim 1,

wherein at least one electronic component is mounted on each of the pair of circuit substrates, the circuit substrates being placed so that surfaces of the circuit substrates on which the electronic components are mounted face each other, the electronic components being housed in the insulating layer.

10. The electronic component built-in module according to claim 1,

wherein no electronic component is housed in the circuit substrates.

11. A method of manufacturing an electronic component built-in module, comprising the steps of:

(a) preparing at least two circuit substrates, in each of which a wiring pattern is formed on an insulating base material that contains a resin and has a glass transition temperature Tg2, and mounting at least one electronic component on at least one of the circuit substrates;

(b) forming a sheet-like material in which a through-hole is formed in a predetermined region, using a mixture containing an inorganic filler and an uncured resin composition that contains at least a thermosetting resin and has a glass transition temperature Tg1;

(c) filling the through-hole with a conductive resin composition;

(d) placing the sheet-like material between the circuit substrates so that a face of each of the at least one of the circuit substrates, on which the at least one electronic component is mounted, is directed to a side of the sheet-like material, and embedding the at least one electronic component inside the sheet-like material by applying pressure in a thickness direction so that the sheet-like material and the circuit substrates are formed into one body; and

(e) forming an insulating layer by allowing the thermosetting resin contained in the sheet-like material to be cured,

wherein the glass transition temperature Tg1 and the glass transition temperature Tg2 satisfy a relationship Tg1>

Tg2, and

wherein a difference between the glass transition temperature Tg1 and the glass transition temperature Tg2 is at least 10°

C. and

wherein a rate of increase in amount of thermal expansion in a thickness direction of the insulating layer at a temperature from Tg2 to Tg1 is smaller than a rate of increase in amount of thermal expansion in a thickness direction of the insulating layer at a temperature higher than Tg1.

12. The method according to claim 11,

wherein in the step (d), an electronic component built-in layer, in which at least one electronic component is embedded in an insulating member containing a resin composition having the glass transition temperature Tg1, further is placed between the circuit substrates, and pressure is applied in the thickness direction.

13. The method according to claim 11,

wherein in the step (d), at least two sheet-like materials, and an electronic component built-in layer in which at least one electronic component is embedded in an insulating member containing a resin composition having the glass transition temperature Tg1, are placed between the circuit substrates so that the sheet-like materials are in contact with the circuit substrates, and pressure is applied in the thickness direction.

14. The method according to claim 12,

wherein a method of manufacturing the electronic component built-in layer comprises the steps of:

forming a wiring pattern on one face of a mold release carrier, and further mounting at least one electronic component thereon;

forming a sheet-like material in which a through-hole is formed in a predetermined region, using a mixture containing an inorganic filler and an uncured resin composition that contains at least a thermosetting resin and has the glass transition temperature Tg1;

filling the through-hole with a conductive resin composition;

laminating the mold release carrier on the sheet-like material so that the one face of the mold release carrier, on which the at least one electronic component is mounted, is directed to a side of the sheet-like material, and embedding the at least one electronic component inside the sheet-like material by applying pressure in a lamination direction; and

peeling the mold release carrier from the sheet-like material.

15. The method according to claim 13,

wherein a method of manufacturing the electronic component built-in layer comprises the steps of:

forming a wiring pattern on one face of a mold release carrier, and further mounting at least one electronic component thereon;

forming a sheet-like material in which a through-hole is formed in a predetermined region, using a mixture containing an inorganic filler and an uncured resin composition that contains at least a thermosetting resin and has the glass transition temperature Tg1;

filling the through-hole with a conductive resin composition;

laminating the mold release carrier on the sheet-like material so that the one face of the mold release carrier, on which the at least one electronic component is mounted, is directed to a side of the sheet-like material, and embedding the at least one electronic component inside the sheet-like material by applying pressure in a lamination direction; and

peeling the mold release carrier from the sheet-like material.