Feedthrough for electrical connectors

• US 7,396,265 B2
• Filed: 09/30/2003
• Issued: 07/08/2008
• Est. Priority Date: 09/30/2002
• Status: Expired due to Fees

• Current Assignee: Cochlear Limited
• Original Assignee: Cochlear Limited
• Inventors: McCusker, Desmond Andrew, Parker, John, Darley, Derek Ian, Milojevic, Dusan
• Primary Examiner(s): NGUYEN, TRUC T
• Application Number:
  US10/529,063
• Publication Number:
  US 20060141861A1
• Time in Patent Office: 1,743 Days
• Field of Search: 438/885, 439/885, 439/587, 29883-884, 298/74, 295/662
• US Class Current: 439/885
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0541 Cochlear electrodes
• CPC Class Codes: H01R 13/5224 for medical use
• CPC Class Codes: H01R 2201/12 for medicine and surgery
• CPC Class Codes: H01R 43/24 Assembling by moulding on contact members
• CPC Class Codes: Y10S 439/909 Medical use or attached to human body
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/4922 with molding of insulation
• CPC Class Codes: Y10T 29/5149 to sever electric terminal from supply strip

Abstract

A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.

Claims

1. A method of forming an electrically conducting feedthrough for implantable medical device comprising:

forming an electrically conductive structure comprising a sacrificial component and a non-sacrificial component comprising at least one electrically conductive elongate member;

coating at least a portion of the non-sacrificial component with an electrically insulating material such that each said at least one electrically conductive elongate member is contiguous and circumferentially covered by said electrically insulating material hermetically sealing said at least one electrically conductive elongate member; and

removing at least a portion of the sacrificial component from the electrically conductive structure to expose opposing ends of said at least one electrically conductive elongate member; and

electrically coupling at least one opposing end of said at least one hermetically sealed and electrically conductive elongate member to the implantable medical device.

2. The method of forming an electrically conducting feedthrough of claim 1 wherein the electrically insulating material is a ceramic material.

3. The method of forming an electrically conducting feedthrough of claim 1 wherein the electrically insulating material is coated on the non-sacrificial component and not coated on to any portion of the sacrificial component of the conductive structure.

4. The method of forming an electrically conducting feedthrough of claim 1 wherein the electrically conductive structure is selected from the group comprising a metal, a metal alloy, an electrically conductive ceramic, an electrically conductive composite, and an intrinsically or extrinsically electrically conductive polymer.

5. The method of forming an electrically conducting feedthrough of claim 1 wherein the shape of the electrically conductive structure is formed in step (i) by punching the shape from a film of electrically conductive material.

6. The method of forming an electrically conducting feedthrough of claim 1 wherein the shape of the electrically conductive structure is formed in step (i) by using electrical discharge machining (EDM) to remove unwanted portions of the film.

7. The method of forming an electrically conducting feedthrough of claim 1 wherein step (i) comprises a step of forming a film of platinum having a plurality of integrally attached substantially elongate members extending outwardly from at least a portion of the periphery thereof.

8. The method of forming an electrically conducting feedthrough of claim 1 wherein step (ii) comprises a step of using powder injection moulding (PIM) to mould the insulating material around said portion of the conductive structure.

9. The method of forming an electrically conducting feedthrough of claim 1 further comprising a step of mounting the feedthrough in an orifice in the wall of a unit adapted to receive the feedthrough.

10. A feedthrough comprised of one or more electrically conductive structures extending through and embedded within a electrically insulating body when formed using the method of claim 1.

11. The method of forming an electrically conducting feedthrough of claim 1 wherein step (ii) comprises a step of mounting or clamping the electrically conductive structure in a mould and then moulding a coating of the insulating material around the conductive structure.

12. The method of forming an electrically conducting feedthrough of claim 4 wherein the electrically conductive structure is formed from a film or shim of platinum.

13. The method of forming an electrically conducting feedthrough of claim 12 wherein the film or shim has a shape comprising two or more conductive elements extending between respective transverse support members.

14. The method of forming an electrically conducting feedthrough of claim 13 wherein at least one of the conductive elements is linear.

15. The method of forming an electrically conducting feedthrough of claim 13 wherein the electrically insulating material is moulded around at least a portion of the conductive elements of the conductive structure.

16. The method of forming an electrically conducting feedthrough of claim 7 wherein the insulating material is moulded to both sides of the film and elongate members, thereby encapsulating at least a portion of the members in the insulating material.