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Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries

  • US 7,396,484 B2
  • Filed: 04/29/2005
  • Issued: 07/08/2008
  • Est. Priority Date: 04/30/2004
  • Status: Active Grant
First Claim
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1. A method for manufacturing a cutting device from a wafer of crystalline material, comprising:

  • forming a trench in the wafer of crystalline material on a first side of a crystalline material, the trench comprising at least one blade profile of a blade; and

    isotropically etching at least the first side of the crystalline material to form at least one cutting edge comprising at least a portion of the at least one blade profile.

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