Lithographic apparatus and device manufacturing method

• US 7,397,533 B2
• Filed: 12/07/2004
• Issued: 07/08/2008
• Est. Priority Date: 12/07/2004
• Status: Expired due to Fees

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Stavenga, Marco Koert, Verhagen, Martinus Cornelis Maria, Jansen, Hans, Verspay, Jacobus Johannus Leonardus Hendricus
• Primary Examiner(s): NGUYEN, HUNG
• Application Number:
  US11/005,221
• Publication Number:
  US 20060119809A1
• Time in Patent Office: 1,309 Days
• Field of Search: 355/53, 355/67, 355 72- 76, 355/30, 355/55, 250/548
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/70808 Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus

Abstract

A lithographic apparatus is disclosed wherein a liquid supply system is configured to at least partly fill a region between a substrate and a projection system of the lithographic apparatus with a liquid and having a liquid confinement structure fixed in a plane substantially perpendicular to an optical axis of the projection system and configured to cooperate with a substrate table configured to hold the substrate in order to restrict the liquid to a region above an upper surface of the substrate table so that a side of the substrate to be exposed is substantially covered in the liquid during exposure.

Claims

1. A lithographic apparatus, comprising:

a projection system configured to project a patterned radiation beam onto a target portion of a substrate;

a substrate table configured to hold the substrate;

a liquid supply system configured to at least partly fill a region between the substrate and the projection system with a liquid;

a saturated gas supply system configured to provide substantially saturated gas to a surface of the substrate not covered by liquid; and

a liquid confinement structure not directly attached to the substrate table and movable in a direction substantially parallel to an optical axis of the projection system, the liquid confinement structure configured to at least partly contain the liquid and comprising an extension structure extending substantially radially, with respect to the optical axis, from the liquid confinement structure to restrict substantially saturated gas to a region above an upper surface of the substrate table.

2. The apparatus according to claim 1, wherein the liquid confinement structure is fixed in a plane substantially perpendicular to the optical axis of the projection system.

3. The apparatus according to claim 1, wherein the extension structure is arranged to cooperate with a vapor sealing projection, forming part of a substrate table configured to hold the substrate, so as to substantially contain the substantially saturated gas.

4. The apparatus according to claim 3, wherein the extension structure and the vapor sealing projection are configured to contain the substantially saturated gas in a region delimited by the substrate table, the substrate, the liquid when provided to the region, the liquid confinement structure, the extension structure and the vapor sealing projection.

5. The apparatus according to claim 3, wherein the vapor sealing projection comprises a gas seal configured to substantially prevent flow of substantially saturated gas through a gap between a surface of the extension structure and the vapor sealing projection.

6. The apparatus according to claim 1, wherein the saturated gas supply system comprises a saturated gas preparer configured to make substantially saturated gas from the liquid.

7. The apparatus according to claim 1, wherein the liquid supply system is configured to supply liquid to a region covering only a localized portion of the substrate at any one time.

8. A lithographic apparatus, comprising:

a substrate table configured to hold a substrate to be exposed;

a projection system configured to project a patterned radiation beam onto a target portion on a side of the substrate to be exposed;

a liquid supply system configured to at least partly fill a region between the substrate and the projection system with a liquid;

a first confinement structure not directly attached to the substrate table and configured to cooperate with the substrate table in order to restrict the liquid to a region above an upper surface of the substrate table;

a second confinement structure not directly attached to the substrate table and configured to cooperate with the substrate table in order to restrict substantially saturated gas to a region above an upper surface of the substrate table;

a seal configured to substantially prevent flow of substantially saturated gas through a gap between a surface of the second confinement structure and the structure table,

wherein the first and second confinement structures and the substrate table are arranged so that a side of the substrate to be exposed is entirely covered with substantially saturated gas except for an area covered with liquid during exposure.

9. The apparatus according to claim 8, wherein the substrate table comprises a vapor sealing projection arranged to cooperate with the second confinement structure so as to substantially contain the substantially saturated gas.

10. The apparatus according to claim 9, wherein the second confinement structure and the vapor sealing projection are configured to contain the substantially saturated gas in a region delimited by the substrate table, the substrate, the liquid when provided to the region, the first confinement structure, the second confinement structure and the vapor sealing projection.

11. The apparatus according to claim 9, wherein the vapor sealing projection comprises the seal, the seal comprising a gas seal configured to substantially prevent flow of substantially saturated gas through a gap between a surface of the second confinement structure and the vapor sealing projection.

12. The apparatus according to claim 8, wherein the liquid supply system is configured to supply liquid to a region covering only a localized portion of the substrate at any one time.

13. The apparatus according to claim 8, further comprising a saturated gas supply system configured to provide substantially saturated gas to a surface of the substrate not covered by liquid.

14. A lithographic apparatus, comprising:

a substrate table configured to hold a substrate to be exposed;

a projection system configured to project a patterned radiation beam onto a target portion of a substrate;

a liquid supply system configured to at least partly fill a region between the substrate and the projection system with a liquid;

a saturated gas supply system configured to provide substantially saturated gas to a surface of the substrate not covered by liquid;

a first confinement structure fixed in a plane substantially perpendicular to an optical axis of the projection system and configured to at least partly contain the liquid; and

a second confinement structure fixed in a plane substantially perpendicular to an optical axis of the projection system and movable in a direction substantially parallel to the optical axis, the second confinement structure configured to cooperate with the substrate table in order to restrict substantially saturated gas to a region above an upper surface of the substrate table,

wherein the first and second confinement structures and the substrate table are arranged so that a side of the substrate to be exposed is entirely covered with substantially saturated gas except for an area covered with liquid during exposure.

15. The apparatus according to claim 14, wherein the substrate table comprises a vapor sealing projection arranged to cooperate with the second confinement structure so as to substantially contain the substantially saturated gas.

16. The apparatus according to claim 15, wherein the vapor sealing projection comprises a gas seal configured to substantially prevent flow of substantially saturated gas through a gap between a surface of the second confinement structure and the vapor sealing projection.

17. A device manufacturing method, comprising:

at least partly filling a region between a projection system of a lithographic apparatus and a substrate with a liquid;

providing a substantially saturated gas to a surface of the substrate not covered by liquid;

projecting a patterned radiation beam through the liquid onto a target portion of the substrate using the projection system;

at least partly containing the liquid using a movable liquid confinement structure that is fixed in a plane substantially perpendicular to the optical axis; and

restricting the substantially saturated gas to a region above an upper surface of the substrate table using an extension structure of the liquid confinement structure, the extension structure extending substantially radially, with respect to an optical axis of the projection system, from the liquid confinement structure.

18. The method according to claim 17, wherein the liquid confinement structure is fixed in a plane substantially perpendicular to the optical axis of the projection system.

19. The method according to claim 17, comprising substantially containing the substantially saturated gas using the extension structure in cooperation with a vapor sealing projection forming part of a substrate table holding the substrate.

20. The method according to claim 19, comprising containing the substantially saturated gas in a region delimited by the substrate table, the substrate, the liquid when provided to the region, the liquid confinement structure, the extension structure and the vapor sealing projection.

21. The method according to claim 19, comprising substantially preventing flow of substantially saturated gas through a gap between a surface of the extension structure and the vapor sealing projection using a gas seal.

22. The method according to claim 17, further comprising making the substantially saturated gas from the liquid.

23. The method according to claim 17, wherein the liquid covers only a localized portion of the substrate at any one time.

24. A device manufacturing method, comprising:

restricting a liquid to a region above an upper surface of a substrate table of a lithographic apparatus holding a substrate using a first confinement structure that is fixed in a plane substantially perpendicular to an optical axis of a projection system of a lithographic apparatus and arranged to cooperate with the substrate table;

restricting substantially saturated gas to a region above an upper surface of the substrate table using a second confinement structure that is fixed in a plane substantially perpendicular to the optical axis and arranged to cooperate with the substrate table;

substantially preventing flow of the substantially saturated gas by sealing through a gap between a surface of the second confinement structure and the substrate table by using a seal;

projecting a patterned radiation beam through the liquid onto a target portion of the substrate using the projection system,

wherein the first and second confinement structures and the substrate table are arranged so that a side of the substrate to be exposed is entirely covered with the substantially saturated gas except for an area covered in the liquid during exposure.

25. The method according to claim 24, comprising substantially containing the substantially saturated gas using a vapor sealing projection of the substrate table in cooperation with the second confinement structure.

26. The method according to claim 25, comprising substantially containing the substantially saturated gas in a region delimited by the substrate table, the substrate, the liquid when provided to the region, the first confinement structure, the second confinement structure and the vapor sealing projection.

27. The method according to claim 25, comprising substantially preventing flow of the substantially saturated gas through a gap between a surface of the second confinement structure and the vapor sealing projection using the seal, the seal comprising a gas seal.

28. The method according to claim 24, wherein the liquid covers only a localized portion of the substrate at any one time.

29. The method according to claim 24, further comprising providing a substantially saturated gas to a surface of the substrate not covered by liquid.

30. A device manufacturing method, comprising:

restricting a liquid to a region between a projection system of a lithographic apparatus and a substrate held on a substrate table of the lithographic apparatus using a first confinement structure that is not directly attached to the substrate table;

supplying a substantially saturated gas to a surface of the substrate not covered by liquid;

restricting substantially saturated gas to a region above an upper surface of the substrate table using a second confinement structure that is not directly attached to the substrate table and is movable in a direction substantially parallel to the optical axis, the second confinement structure arranged to cooperate with the substrate table; and

projecting a patterned radiation beam through the liquid onto a target portion of the substrate using the projection system,

wherein the first and second confinement structures and the substrate table are arranged so that a side of the substrate to be exposed is entirely covered with the substantially saturated gas except for an area covered in the liquid during exposure.

31. The apparatus according to claim 30, comprising substantially containing the substantially saturated gas using a vapor sealing projection of the substrate table in cooperation with the second confinement structure.

32. The apparatus according to claim 31, comprising substantially preventing flow of substantially saturated gas through a gap between a surface of the second confinement structure and the vapor sealing projection using a gas seal.