Object positioning method for a lithographic projection apparatus

• US 7,397,940 B2
• Filed: 02/08/2001
• Issued: 07/08/2008
• Est. Priority Date: 02/10/2000
• Status: Expired due to Fees

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Willems van Dijk, Marcus J. H., van de Pasch, Engelbertus A. F., Ariens, Andreas B. G., Castenmiller, Thomas J. M.
• Primary Examiner(s): Bali; Vikkram
• Application Number:
  US09/777,460
• Publication Number:
  US 20010014170A1
• Time in Patent Office: 2,707 Days
• Field of Search: 382/141, 382143-151, 382/287, 348/86, 348/97, 348/94, 348/95, 348/126, 700/95, 298/33, 356/401, 356/237.1, 356/399, 356/237.4, 356/237.5, 355/67, 310/12
• US Class Current: 382/144
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: G03F 9/7011 Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder

Abstract

A method for placement of a object such as a substrate or a mask on a table, said method including:

• • a first placement step in which the object is placed on a first position on the table;
  • a measuring step in which a displacement between the first position of the object and the required position of the object is determined;
  • a removing step in which the object is released and removed from the table;
  • a moving step in which the object and the table are moved relatively to each other by substantially the said displacement, in a direction substantially parallel to the surface of the table; and
  • a second placement step in which the object is placed at the required position on the table.

Claims

1. A method of positioning an object at a required position on a first object table in a lithographic projection apparatus, comprising:

placing an object at a first position on the first object table;

measuring a displacement between the first position of the object and a required position of the object on the first object table;

removing the object from the first object table;

translating the removed object, the first object table, or both, relative to each other by substantially the measured displacement, in a direction substantially parallel to the plane of the first object table; and

placing the object at substantially the required position on the first object table,

wherein a first surface of the object contacts the first object table, and wherein the required position corresponds to a position of the object at which a clamping force that clamps the object on the first object table is substantially homogenous on the first surface of the object.

2. A method according to claim 1, wherein said measuring comprises aligning a first mark on the object to a second mark.

3. A method according to claim 2, wherein said second mark is located on the one of the first object table and a second object table.

4. A method according to claim 1, wherein a mask is held by the first object table.

5. A method according to claim 2, wherein said second mark is located on one of a mask and a substrate.

6. A method according to claim 1, wherein said measuring is accomplished using imaging means to determine the displacement between the first position of the object and the required position of the object.

7. A method according to claim 1, wherein said measuring comprises processing information about the first position of the object, together with information regarding the required position of the object to determine said displacement.

8. A method according to claim 1, wherein said object is held in place using a vacuum generating surface.

9. A method according to claim 1, wherein the translating includes translating the object, the first object table, or both, relatively to each other in two directions.

10. A method of positioning a substrate at a required position on a substrate table, said method comprising:

placing the substrate at a first position on the substrate table;

measuring a displacement between the first position of the substrate and a required position of the substrate on the substrate table;

removing the substrate from the substrate table;

translating the substrate, the substrate table, or both, relative to each other by substantially the displacement, in a direction substantially parallel to the plane of the substrate table; and

placing the substrate at substantially the required position on the substrate table,

wherein a first surface of the substrate contacts the substrate table, and wherein the required position corresponds to a position of the substrate at which a clamping force that clamps the substrate on the substrate table is substantially homogenous on the first surface of the substrate.

11. A method according to claim 10, wherein said, measuring comprises aligning a first mark on the substrate to a second mark.

12. A method according to claim 10, wherein said measuring is accomplished using an imaging device to determine the displacement between the first position of the substrate and the required position of the substrate.

13. A method according to claim 10, wherein said measuring comprises processing information about the first position of the substrate, together with information regarding the required position of the substrate to determine said displacement.

14. A method according to claim 10, wherein the translating includes translating the substrate, the substrate table, or both, relatively to each other in two directions.