Method for manufacturing a capacitance type sensor with a movable electrode

• US 7,398,587 B2
• Filed: 10/06/2004
• Issued: 07/15/2008
• Est. Priority Date: 05/29/2002
• Status: Expired due to Fees

• Current Assignee: Nitta Corporation
• Original Assignee: Nitta Corporation
• Inventors: Morimoto, Hideo
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US10/959,756
• Publication Number:
  US 20050057266A1
• Time in Patent Office: 1,378 Days
• Field of Search: 29/254.2, 29/250.3, 295/94, 295/921, 29854-858, 296211-622, 296/021, 264/135, 264/271, 264/271.11, 264/294, 324/686, 324/661, 735/143.2, 737/80, 438126-128, 438/112
• US Class Current: 29/592.1
• CPC Class Codes: G01L 1/142 using capacitors
• CPC Class Codes: G01L 1/144 with associated circuitry G01L1/146 and G01L1/148 take precedence
• CPC Class Codes: G01L 5/165 using variations in capacitance
• CPC Class Codes: G01L 5/223 to joystick controls
• CPC Class Codes: G01L 9/0072 using variations in capacitance
• CPC Class Codes: G06F 1/3215 Monitoring of peripheral devices
• CPC Class Codes: G06F 3/044 by capacitive means
• CPC Class Codes: H01H 2025/048 having a separate central push, slide or tumbler button which is not integral with the operating part that surrounds it
• CPC Class Codes: H01H 2239/006 Containing a capacitive switch or usable as such
• CPC Class Codes: H01H 2300/022 Application wake up; switches or contacts specially provided for the wake up or standby shift of a circuit
• CPC Class Codes: H01H 25/041 having a generally flat operating member depressible at different locations to operate different controls
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49103 Strain gauge making

Abstract

Disclosed is a method for manufacturing a capacitance type sensor comprising an insert molding process for insert-molding, with an insulating material, a part of a lead wire of a leadframe and a range of the leadframe including the capacitance element electrode, the leadframe being formed by integrally forming with a frame the capacitance element electrode and the lead wire thereof in a predetermined pattern. The method comprises a cutting process for cutting the lead wire of the capacitance element electrode off the frame. It further comprises a conductive member arranging process for arranging, to a mold product obtained by the insert molding process, the conductive member at a distance from the capacitance element electrode. Also included is a movable electrode arranging process for arranging, to the mold product, the movable electrode to be in contact with the lead wire of the movable electrode at a distance from the conductive member.

Claims

1. A method for manufacturing a capacitance type sensor having a conductive member, a capacitance element electrode constituting a capacitance element with the conductive member, and at least one movable electrode disposed on the side opposite to the capacitance element electrode at a distance from the conductive member;

the method comprising;

an insert molding process for insert-molding, with an insulating material, a part of each lead wire of a leadframe and a range of the leadframe including the capacitance element electrode, the leadframe being formed by integrally forming with a frame the capacitance element electrode, the lead wire thereof, and a lead wire of the movable electrode in a predetermined pattern;

a cutting process for cutting the lead wire of the capacitance element electrode off the frame;

a conductive member arranging process for arranging, to a mold product obtained by the insert molding process, the conductive member at a distance from the capacitance element electrode; and

a movable electrode arranging process for arranging, to the mold product, the movable electrode to be in contact with the lead wire of the movable electrode and at a distance from the conductive member.

2. The method for manufacturing a capacitance type sensor according to claim 1, wherein in the insert molding process, insert-molding is carried out to form, in the mold product, a step for supporting the conductive member and a step for supporting the movable electrode.