Micromechanical sensor element

• US 7,398,671 B2
• Filed: 03/15/2002
• Issued: 07/15/2008
• Est. Priority Date: 03/19/2001
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Brederlow, Ralf, Thewes, Roland
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US10/472,632
• Publication Number:
  US 20040093947A1
• Time in Patent Office: 2,314 Days
• Field of Search: 735/80, 73/240.6, 73/617.5, 73/617.9, 422/69, 435/287.9
• US Class Current: 73/24.06
• CPC Class Codes: G01N 2291/0256 Adsorption, desorption, surface mass change, e.g. on biosensors
• CPC Class Codes: G01N 2291/02863 Electric or magnetic parameters
• CPC Class Codes: G01N 29/036 by measuring frequency or resonance of acoustic waves

Abstract

A micromechanical sensor element for recording the bonding of molecules to the micromechanical sensor element. The sensor element having a substrate and at least one electrical terminal. There is also an oscillatable element that is coupled to the electrical terminal in such a manner that an electrical variable that characterizes the oscillation behavior of the oscillatable element may be provided at the electrical terminal. Further, there is a molecule coupling layer, arranged in such a manner that molecules may bond to the molecule coupling layer. The molecule coupling layer is coupled to the oscillatable element in such a manner that bonding of molecules to the molecule coupling layer causes a change in the oscillation behavior of the oscillation element.

Claims

1. A micromechanical sensor element for recording the bonding of molecules to the micromechanical sensor element, comprising:

a substrate;

at least one electrical terminal;

an oscillatable element applied to the substrate, wherein the oscillatable element is secured to the substrate at least along a closed periphery and is coupled to a first of the at least one electrical terminal in such a manner that an electrical variable which characterizes the oscillation behavior of the oscillatable element is provided at the first of the at least one electrical terminal, wherein the oscillatable element comprises an oscillatable membrane, which is applied to the substrate in such a manner that a cavity is formed between the oscillatable membrane and the substrate, so that the membrane can be deflected into the cavity, wherein the oscillatable membrane is coupled to the first of the at least one electrical terminal, wherein at least one spacer element is provided between the substrate and the oscillatable membrane, and wherein the cavity is filled with piezoelectric material;

a molecule coupling layer, which is oriented in such a manner that molecules can bond to the molecule coupling layer;

the molecule coupling layer being coupled to the oscillatable element in such a manner that bonding of molecules to the molecule coupling layer can cause a change in the resonant frequency of the oscillatable element; and

an electric circuit for determining the oscillation behavior of the oscillatable element, wherein

the electric circuit is coupled to the oscillatable element via at least the first of the at least one electrical terminal, and wherein

the electric circuit comprises means for generating an actuation signal with a predetermined frequency, by means of which actuation signal the oscillatable element is excited into oscillation;

a feedback mechanism that feeds a signal based on an output of the oscillatable element back into the oscillatable element; and

means for detecting and/or evaluating the change in the resonant frequency of the oscillatable element caused by the bonding of molecules to the molecule coupling layer, and wherein

the electric circuit is integrated in the substrate or applied to the substrate of the micromechanical sensor element.

2. The micromechanical sensor element as claimed in claim 1, in which the oscillatable membrane is made from the same base material as the substrate.

3. The micromechanical sensor element as claimed in claim 1, in which a recess is introduced into that surface of the substrate which is remote from the oscillatable membrane.

4. The micromechanical sensor element as claimed in claim 1, in which the means for generating the actuation signal comprises a frequency generator;

and

in which the means for detecting and/or evaluating the change in the resonant frequency of the oscillatable element comprises a signal detector.

5. The micromechanical sensor element as claimed in claim 4, further comprising the frequency generator being connected in parallel with an inductor or a gyrator circuit.