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Fluidic pump for heat management

  • US 7,398,818 B2
  • Filed: 12/27/2005
  • Issued: 07/15/2008
  • Est. Priority Date: 12/28/2004
  • Status: Expired due to Fees
First Claim
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1. An apparatus, comprising:

  • an electronically operated device;

    a fluid filled conduit, thermally in contact with at least a portion of said heat producing device, and includes a fluid therein;

    a pump, of a type that pumps said fluid through the conduit, but does not extend through any outer walls of the conduit to the inside of the conduit; and

    wherein said fluid filled conduit includes a first portion forming said thermally contact, and includes a second portion which releases heat, wherein said conduit is formed of a plurality of mechanical segments having different fluidic characteristics, and said pump is an impedance pump that causes fluid to flow based on fluidic impedance differences between different mechanical segments of the conduit, and which includes an actuator that reduces an internal area of at least one area of the conduit to cause said fluid to flow,and further comprising a controller which controls said actuator to a resonance point of the system that creates a maximum pumping effect.

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