Micro-electromechanical fluid ejection device with through-wafer inlets and nozzle chambers

• US 7,399,063 B2
• Filed: 09/14/2005
• Issued: 07/15/2008
• Est. Priority Date: 06/09/1998
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia, McAvoy, Gregory John
• Primary Examiner(s): Do; An H
• Application Number:
  US11/225,157
• Publication Number:
  US 20060007268A1
• Time in Patent Office: 1,035 Days
• Field of Search: 347/54, 347/65
• US Class Current: 347/54
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2/1433 Structure of nozzle plates
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1637 molding
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1648 Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/17596 Ink pumps, ink valves
• CPC Class Codes: B41J 2002/041 Electromagnetic transducer
• CPC Class Codes: B41J 2002/14346 Ejection by pressure produced by thermal deformation of ink chamber, e.g. buckling
• CPC Class Codes: B41J 2002/14435 Moving nozzle made of thermal bend detached actuator
• CPC Class Codes: B41J 2002/14475 characterised by nozzle shapes or number of orifices per chamber
• CPC Class Codes: B41J 2202/15 Moving nozzle or nozzle plate
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 : with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49401 : Fluid pattern dispersing device making, e.g., ink jet

Abstract

A micro-electromechanical fluid ejection device includes a substrate. Drive circuitry is arranged on an outlet side of the substrate. A plurality of nozzle chambers and corresponding fluid inlets is etched into the substrate. A plurality of support structures is positioned on the substrate to cover respective nozzle chambers. Each support structure defines a fluid ejection nozzle in fluid communication with the respective nozzle chamber. A plurality of fluid ejecting members is arranged in respective support structures. The fluid ejecting members are displaceable into and out of the nozzle chambers to eject fluid from respective fluid ejection nozzles. A plurality of actuators is connected to the drive circuitry and to respective fluid ejecting members to displace respective fluid ejecting members into and out of each nozzle chamber on receipt of electrical signals from the drive circuitry to eject ink from each fluid ejection nozzle.

Claims

1. A micro-electromechanical fluid ejection device that comprises

a substrate;

drive circuitry arranged on an outlet side of the substrate;

a plurality of nozzle chambers and corresponding fluid inlets etched into the substrate;

a plurality of support structures positioned on the substrate to cover respective nozzle chambers, each support structure defining a fluid ejection nozzle in fluid communication with the respective nozzle chamber;

a plurality of fluid ejecting members arranged in respective support structures and displaceable into and out of the nozzle chambers to eject fluid from respective fluid ejection nozzles; and

a plurality of actuators connected to the drive circuitry and to respective fluid ejecting members to displace respective fluid ejecting members into and out of each nozzle chamber on receipt of electrical signals from the drive circuitry to eject ink from each fluid ejection nozzle;

wherein each support structure includes a number of arms that are fast with the substrate at one end and extend radially inwardly, and a fluid ejection nozzle rim fast with the arms at an opposite end and defining the fluid ejection nozzle, each fluid ejecting member being interposed between adjacent arms.

2. A micro-electromechanical fluid ejection device as claimed in claim 1, in which the drive circuitry is defined by a CMOS layer positioned on the substrate.

3. A micro-electromechanical fluid ejection device as claimed in claim 1, in which each actuator is of a material having a suitable coefficient of thermal expansion such that the material can expand and contract to perform work and includes a heater element positioned in the material and connected to the drive circuitry layer such that heating and subsequent cooling of the material results in differential thermal expansion and contraction of the material.

4. A micro-electromechanical fluid ejection device as claimed in claim 3, in which said material of each actuator is polytetrafluoroethylene, while each heater element is defined by a serpentine core of a metal selected from copper and gold.

5. A micro-electromechanical fluid ejection device as claimed in claim 1, in which the fluid ejection members and the arms are disposed radially symmetrically relative to said fluid ejection nozzle.

6. A micro-electromechanical fluid ejection device as claimed in claim 1, in which each nozzle chamber is the result of an etching process carried out on the outlet side of the substrate, while each fluid inlet is the result of a back-etching process carried out on an inlet side of the substrate.