Sensor configuration for a capsule endoscope

• US 7,399,274 B1
• Filed: 08/19/2003
• Issued: 07/15/2008
• Est. Priority Date: 08/19/2003
• Status: Active Grant

• Current Assignee: National Semiconductor Corporation (Texas Instruments, Inc.)
• Original Assignee: National Semiconductor Corporation (Texas Instruments, Inc.)
• Inventors: Halla, Brian Lester, Wang, Peter Yi-Ning, Montalbo, Joseph Domenick, Padmanabhan, Gobi R.
• Primary Examiner(s): Leubecker; John P.
• Application Number:
  US10/643,457
• Time in Patent Office: 1,792 Days
• Field of Search: 600/160, 600/109, 600/407, 600/476, 600/473, 600/474, 600/549, 600/547, 600/561, 348/65, 348/76
• US Class Current: 600/160
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/041 Capsule endoscopes for imaging
• CPC Class Codes: A61B 2562/164 the sensor is mounted in or on a conformable substrate or carrier
• CPC Class Codes: A61B 5/073 Intestinal transmitters
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

The present invention provides a capsule endoscope (CE) having sensors configured to form or to conform to the shell of the CE. The sensors are curved to correspond to the capsule'"'"'s shape. According to this embodiment, the sensors may be covered by a coating material to protect the sensors. The sensors may also form the capsule shell. Instead of being covered by a shell associated with the capsule, the sensors are formed as the capsule shell. The sensors may also form part of the capsule shell. For example, one half of the capsule shell may be formed from the sensors.

Claims

1. An apparatus, comprising:

a capsule endoscope having a shape, wherein the shape has a contour, at least a portion of the contour is curved, and wherein the capsule endoscope includes;

a shell, wherein the shell includes one or more sensors, and wherein at least one of the one or more sensors is curved to shape to the contour, wherein the capsule endoscope further includes a substrate that includes the one or more sensors, wherein the substrate is formed sufficiently thin that it can be shaped to the contour, and wherein the capsule endoscope further includes;

a support having sufficient flexibility such that the support can be formed to the contour, wherein the substrate is coupled with the support such that the combination can be formed to the contour.

2. The apparatus of claim 1, wherein the support is formed of a laminate of polyimide and copper layers;

and wherein the substrate is comprised of a semiconductor substrate.

3. The apparatus of claim 1, wherein the capsule endoscope further includes a protective housing, and wherein the support and substrate are arranged inside of the protective housing.

4. The apparatus of claim 3, wherein the protective housing includes a portion of an optically transmissive surface.

5. A device, comprising:

a capsule endoscope having a shape, wherein the shape has a contour, at least a portion of the contour is curved, and wherein the capsule endoscope includes;

one or more sensors, and wherein at least one of the one or more sensors includes a semiconductor material that is curved to shape to the contour, wherein the capsule endoscope further includes a support having sufficient flexibility such that the support can be formed to the contour, the substrate is coupled with the support such that the combination can be formed to the contour, the support has electrical contact pads formed thereon;

wherein the one or more sensors of the substrate have electrical contacts;

the electrical contacts of the substrate are electrically connected to the electrical contact pads of the support; and

wherein electrical connections between the electrical contact pads of the support and the electrical contacts of the sensors of the substrate are encapsulated with a protective covering.

6. The device of claim 5, wherein a sensor of the one or more sensors is at least one of:

a temperature sensor, a pH sensor, an infrared sensor, an imaging sensor, or an active sensor.

7. The device of claim 5, wherein the capsule endoscope further includes a lens covering at least one of the one or more sensors.

8. The device of claim 5, wherein the one or more sensors are made of an organic semiconductor.

9. The device of claim 5, wherein the capsule endoscope includes a shell that is curved to the shape of the contour.

10. The device of claim 9, wherein the shell is distinct from the one or more sensors.

11. The device of claim 9, wherein the one or more sensors form a portion of the shell.

12. The device of claim 9, wherein the capsule endoscope further includes an outer shell that covers at least a portion of the shell.

13. The device of claim 9, wherein the capsule endoscope further includes a covering that is applied over at least a portion of the shell.

14. The device of claim 5, wherein the semiconductor material is formed sufficiently thin that it can be shaped to the contour.

15. The device of claim 14, wherein the substrate includes a silicon material.

16. The device of claim 14, wherein the substrate has a thickness of about 25 microns to about 125 microns.

17. The device of claim 14, further comprising an illuminator positioned on the shell.

18. The device of claim 5, wherein the support is formed of a laminate of polyimide and copper layers;

and wherein the substrate is comprised of a semiconductor substrate.

19. The device of claim 5, wherein the capsule endoscope further includes a protective housing, and wherein the support and substrate are arranged inside of the protective housing.

20. The device of claim 19, wherein the protective housing includes a portion of an optically transmissive surface.