Method of forming a structure over a semiconductor substrate

• US 7,399,714 B2
• Filed: 01/14/2004
• Issued: 07/15/2008
• Est. Priority Date: 06/22/2000
• Status: Expired due to Fees

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Moore, John T., Beaman, Kevin L.
• Primary Examiner(s): Smoot; Stephen W.
• Application Number:
  US10/757,276
• Publication Number:
  US 20040147069A1
• Time in Patent Office: 1,644 Days
• Field of Search: 438/216, 438/287, 438/775, 438/786, 438/591
• US Class Current: 438/775
• CPC Class Codes: H01L 21/823842 gate conductors with different gate conductor materials or different gate conductor implants, e.g. dual gate structures
• CPC Class Codes: H01L 21/823857 with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants
• CPC Class Codes: H01L 27/105 including field-effect components
• CPC Class Codes: H10B 41/49 comprising different types of peripheral transistor
• CPC Class Codes: H10B 99/00 Subject matter not provided for in other groups of this subclass
• CPC Class Codes: Y10S 257/90 MOSFET type gate sidewall insulating spacer

Abstract

The invention includes a method of forming a structure over a semiconductor substrate. A silicon dioxide containing layer is formed across at least some of the substrate. Nitrogen is formed within the silicon dioxide containing layer. Substantially all of the nitrogen within the silicon dioxide is at least 10 Å above the substrate. After the nitrogen is formed within the silicon dioxide layer, conductively doped silicon is formed on the silicon dioxide layer.

Claims

1. A method of forming a structure over a semiconductor substrate, comprising:

forming a silicon-dioxide-containing layer physically against the semiconductor substrate;

exposing the silicon-dioxide-containing layer to an activated nitrogen species formed from plasma conditions to provide nitrogen within the silicon-dioxide-containing layer, substantially all of the nitrogen within the silicon-dioxide-containing layer being spaced from the substrate;

after the exposing to provide the nitrogen within the silicon-dioxide-containing layer, forming a first layer comprising conductively doped silicon physically against the silicon-dioxide-containing layer, the first layer comprising a first conductivity type; and

forming a second layer comprising conductively doped silicon over the first layer, the second layer comprising a second conductivity type that is different from the first conductivity type.

2. The method of claim 1, wherein the silicon-dioxide-containing layer is at least about 40 angstroms thick, and wherein substantially all of the nitrogen is within the top 30 angstroms of the silicon-dioxide-containing layer.

3. The method of claim 1, wherein the silicon-dioxide-containing layer is at least about 40 angstroms thick, and wherein substantially all of the nitrogen is within the top 10 angstroms of the silicon-dioxide-containing layer.

4. The method of claim 1, wherein an entirety of the nitrogen within the silicon-dioxide-containing layer is spaced from the substrate.

5. The method of claim 4, wherein the silicon-dioxide-containing layer is at least about 40 angstroms thick, and wherein substantially all of the nitrogen is within the top 10 angstroms of the silicon-dioxide-containing layer.

6. The method of claim 4, wherein the silicon-dioxide-containing layer is at least about 40 angstroms thick, and wherein no measurable nitrogen is below the top 30 angstroms of the silicon-dioxide-containing layer.

7. The method of claim 1 further comprising:

forming the activated nitrogen species comprising a first energy state; and

before the exposing, changing the first energy state of the activated nitrogen species to a second energy state that is different from the first energy state.

8. The method of claim 7 wherein the second energy state is a lower energy state than the first energy state.

9. The method of claim 1 further comprising forming a silicide layer over at least one of the first layer and the second layer comprising conductively doped silicon.

10. A method of forming a structure over a semiconductor substrate, comprising:

forming a silicon-dioxide-containing layer physically against the semiconductor substrate, the silicon-dioxide-containing layer having an upper portion and a lower portion, the upper portion being spaced from the semiconductor substrate by the lower portion;

after forming the silicon-dioxide-containing layer, exposing the silicon-dioxide-containing layer to nitrogen ions to provide nitrogen within only the upper portion of the silicon-dioxide-containing layer;

after providing the nitrogen within only the upper portion of the silicon-dioxide-containing layer, forming conductively doped amorphous silicon physically against the upper portion of the silicon-dioxide-containing layer; and

oxidizing the conductively doped amorphous silicon.

11. The method of claim 10, wherein the lower portion is about 10 angstroms thick.

12. The method of claim 10, wherein the upper portion is about 10 angstroms thick.

13. The method of claim 10 further comprising:

forming the nitrogen ions comprising a first energy state; and

before the exposing, changing the first energy state of the nitrogen ions to a second energy state that is different from the first energy state.

14. The method of claim 13 wherein the second energy state is a lower energy state than the first energy state.

15. The method of claim 10 further comprising forming a silicide layer over the conductively doped amorphous silicon.

16. The method of claim 10 further comprising forming conductive material over the conductively doped amorphous silicon, the conductive material comprising a conductivity type that is different from a conductivity type of the conductively doped amorphous silicon.

17. The method of claim 10 wherein the forming of the conductively doped amorphous silicon comprises providing the conductively doped amorphous silicon over a first region of the semiconductor substrate, and further comprising:

exposing a second region of the semiconductor substrate, the second region being different from the first region; and

wherein the oxidizing comprises oxidizing the conductively doped amorphous silicon and the second region of the semiconductor substrate.

18. A method of forming a structure over a semiconductor substrate, comprising:

providing a semiconductor substrate comprising a first region and a second region that is different from the first region;

forming a silicon-dioxide-containing layer physically against only the first region of the semiconductor substrate, the silicon-dioxide-containing layer comprising an upper surface;

exposing the silicon-dioxide-containing layer to nitrogen atoms, and during the exposing, the nitrogen atoms comprising a higher energy state than their ground state to provide nitrogen primarily within the upper surface of the silicon-dioxide-containing layer;

forming conductively doped silicon physically against the upper surface of the silicon-dioxide-containing layer and leaving the second region of the semiconductor substrate exposed; and

oxidizing the conductively doped silicon and the second region of the semiconductor substrate.

19. The method of claim 18, wherein the silicon-dioxide-containing layer further comprises an upper portion and a lower portion, the upper portion including the upper surface and being spaced from the substrate by the lower portion, and wherein the providing of the nitrogen comprises an entirety of the nitrogen within the upper portion.

20. The method of claim 18, wherein the silicon-dioxide-containing layer further comprises an upper portion and a lower portion, the upper portion including the upper surface and being spaced from the substrate by the lower portion, and wherein the providing of the nitrogen comprises substantially all of the nitrogen within the upper portion.

21. The method of claim 18, wherein the silicon-dioxide-containing layer further comprises an upper portion and a lower portion, the upper portion including the upper surface and being spaced from the substrate by the lower portion, and wherein the providing of the nitrogen comprises no measurable amount of the nitrogen within the lower portion.

22. The method of claim 21, wherein the lower portion is about 10 angstroms thick.

23. The method of claim 21, wherein the upper portion is about 10 angstroms thick.

24. The method of claim 21, wherein the silicon-dioxide-containing layer is at least about 40 angstroms thick, and wherein the upper portion is about 10 angstroms thick.

25. The method of claim 18 further comprising:

forming the nitrogen atoms comprising a first energy state; and

before the exposing, changing the first energy state of the nitrogen atoms to a second energy state that is different from the first energy state.

26. The method of claim 25 wherein the second energy state is a lower energy state than the first energy state.

27. The method of claim 18 further comprising forming a silicide layer over the conductively doped silicon.

28. The method of claim 18 wherein the first region of the semiconductor substrate comprises a first conductivity type and the second region comprises a second conductivity type that is different from the first conductivity type.

29. A method of forming a structure over a semiconductor substrate, comprising:

forming a silicon-dioxide-containing layer physically against the semiconductor substrate, the silicon-dioxide-containing layer having an upper portion and a lower portion, the upper portion being spaced from the semiconductor substrate by the lower portion;

after forming the silicon-dioxide-containing layer, exposing the silicon-dioxide-containing layer to nitrogen ions to provide nitrogen within only the upper portion of the silicon-dioxide-containing layer;

after providing the nitrogen within only the upper portion of the silicon-dioxide-containing layer, forming conductively doped amorphous silicon physically against the upper portion of the silicon-dioxide-containing layer; and

forming conductive material over the conductively doped amorphous silicon, the conductive material comprising a conductivity type that is different from a conductivity type of the conductively doped amorphous silicon.

30. A method of forming a structure over a semiconductor substrate, comprising:

forming a silicon-dioxide-containing layer physically against the semiconductor substrate, the silicon-dioxide-containing layer having an upper portion and a lower portion, the upper portion being spaced from the semiconductor substrate by the lower portion;

after forming the silicon-dioxide-containing layer, exposing the silicon-dioxide-containing layer to nitrogen ions to provide nitrogen within only the upper portion of the silicon-dioxide-containing layer;

after providing the nitrogen within only the upper portion of the silicon-dioxide-containing layer, forming conductively doped amorphous silicon physically against the upper portion of the silicon-dioxide-containing layer; and

wherein the forming of the conductively doped amorphous silicon comprises providing the conductively doped amorphous silicon over a first region of the semiconductor substrate, and further comprising;

exposing a second region of the semiconductor substrate, the second region being different from the first region; and

oxidizing the conductively doped amorphous silicon and the second region of the semiconductor substrate.