Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor

• US 7,401,402 B2
• Filed: 02/27/2004
• Issued: 07/22/2008
• Est. Priority Date: 03/11/2003
• Status: Expired due to Fees

• Current Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.)
• Original Assignee: ADC GmbH (TE Connectivity Ltd. (United Kingdom))
• Inventors: Hetzer, Ulrich, Bresche, Peter
• Primary Examiner(s): Arbes; Carl J.
• Application Number:
  US10/547,498
• Publication Number:
  US 20060264106A1
• Time in Patent Office: 1,607 Days
• Field of Search: 298/25, 298/31, 298/32, 298/42, 298/46, 298/47
• US Class Current: 29/842
• CPC Class Codes: H01R 13/6466 on substrates, e.g. printed circuit boards [PCB]
• CPC Class Codes: H01R 13/6473 Impedance matching
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/09236 Parallel layout layout of balanced signal pairs H05K1/0245; superposed layout H05K2201/09672
• CPC Class Codes: H05K 2203/171 Tuning, e.g. by trimming of printed components or high frequency circuits
• CPC Class Codes: H05K 2203/175 Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
• CPC Class Codes: H05K 3/027 the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
• CPC Class Codes: Y10S 439/941 Crosstalk suppression
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49135 and shaping, e.g., cutting or bending, etc.
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor

Abstract

The invention relates to a method for high-frequency tuning a high-frequency plug connector, comprising a printed circuit board that has both contact points for high-frequency contacts as well as contact points for insulation displacement contacts. Each contact point for the high-frequency contacts is connected to one respective contact point for the insulation displacement contacts. Capacitive couplings, which cause a near-end crosstalk, occur between the high-frequency contacts. At least one first conductor path, which is connected on only one side to a contact point of an electrical contact, is situated on the printed circuit board that, together with at least one second conductor path, which is situated on and/or inthe printed circuit board, forms a capacitor. At least one frequency-dependent parameter of the device is measured, and this frequency-dependent parameter is compared to a set parameter and, according to on a difference between the two, the conductor path that is contacted on one side is partially removed or completely separated.

Claims

1. A method for RF matching of an RF plug connector, the RF plug connector having a printed circuit board, the printed circuit board having contact points for RF contacts and contact points for insulation-displacement contacts, wherein a contact point for each of the RF contacts is connected to a respective contact point for the insulation-displacement contacts, and wherein capacitive coupling, which causes near-end crosstalk, occurs between the RF contacts, the method comprising:

arranging at least one first conductor track, which is connected on only one side to a contact point of an electrical contact, on the printed circuit board;

arranging at least one second conductor track either on or in the printed circuit board, to form a capacitor, the capacitor having at least one frequency-dependent parameter;

measuring the at least one frequency-dependent parameter;

comparing the frequency-dependent parameter with a nominal parameter to determine a difference; and

partially removing or cutting through the first conductor track on one side as a function of the difference.

2. The method as claimed in claim 1, wherein the second conductor track is in the form of a conductor track with which contact is made on one side.

3. The method as claimed in claim 1, wherein at least one further second conductor track is arranged in an internal layer in the printed circuit board and is connected to the second conductor track that is arranged on the printed circuit board.

4. The method as claimed in claim 1, wherein at least two matchable capacitors are arranged on the printed circuit board.

5. The method as claimed in claim 1, wherein the frequency-dependent parameters are determined on the unpopulated printed circuit board.

6. The method as claimed in claimed claim 1, wherein in a first step, only a portion of the estimated conductor track shortening that is necessary is carried out, the frequency-dependent parameter is measured once again, and the still to be removed or to be cut is determined from this.

7. The method as claimed in claim 6, wherein, in the final step, the conductor track is cut in a broader manner than in the first step.

8. The method as claimed in claim 1, wherein near crosstalk is determined as the frequency-dependent parameter.

9. The method as claimed in claim 1, wherein the conductor track is cut by means of a laser.

10. The method as claimed in claim 9, wherein the process of controlling the laser is assisted by means of an optical system.