Device with integrated microfluidic and electronic components
First Claim
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1. A device comprising:
- a) a microfluidic component having a microfluidic feature for carrying a fluid of interest;
b) an array component comprising a flexible array substrate supporting an addressable collection of probes, said array component bonded to and in operable association with said microfluidic feature of the microfluidic component for analyzing said fluid of interest, wherein the flexible array substrate includes;
a flexible support,a flexible base mounted on said flexible support,a reflective layer mounted on said base, the reflective layer comprising multiple dielectric layers, said dielectric layers being constructed by repeating pairs of transparent dielectrics, each dielectric in a pair having a different index of refraction from the other dielectric in the pair, anda transparent layer mounted on said reflective layer; and
c) an electronics component joined to said microfluidic component, wherein said electronics component is formed of discrete electronic devices on a substrate that is bonded to said microfluidic component via at least one of the following;
contact solder, gold contact bumps, gold contact pads, and conductive adhesive, in order to provide electrical contact between the electronics component and the microfluidic component.
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Abstract
Devices having microfluidic features and arrays joined to electronics components are described. In an embodiment, the array includes a flexible array substrate. The electronics components have circuitry that may e.g. detect reactions or control conditions on the device via a feedback loop. Modular architecture provides for different combinations of microfluidic components, array components, and/or electronics components that can be used to create customized processing and analysis tools.
73 Citations
35 Claims
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1. A device comprising:
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a) a microfluidic component having a microfluidic feature for carrying a fluid of interest; b) an array component comprising a flexible array substrate supporting an addressable collection of probes, said array component bonded to and in operable association with said microfluidic feature of the microfluidic component for analyzing said fluid of interest, wherein the flexible array substrate includes; a flexible support, a flexible base mounted on said flexible support, a reflective layer mounted on said base, the reflective layer comprising multiple dielectric layers, said dielectric layers being constructed by repeating pairs of transparent dielectrics, each dielectric in a pair having a different index of refraction from the other dielectric in the pair, and a transparent layer mounted on said reflective layer; and c) an electronics component joined to said microfluidic component, wherein said electronics component is formed of discrete electronic devices on a substrate that is bonded to said microfluidic component via at least one of the following;
contact solder, gold contact bumps, gold contact pads, and conductive adhesive, in order to provide electrical contact between the electronics component and the microfluidic component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 29, 30, 31, 32, 33, 34, 35)
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23. An integrated microfluidic device comprising:
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a) a microfluidic component having a microfluidic feature; b) a flexible array substrate bonded to and in fluid communication with the microfluidic feature, wherein the flexible array substrate includes; a flexible support, a flexible base mounted on said flexible support, and a reflective layer mounted on said base, the reflective layer comprising multiple dielectric layers, said dielectric layers being constructed by repeating pairs of transparent dielectrics, each dielectric in a pair having a different index of refraction from the other dielectric in the pair; and c) an electronics component joined to said microfluidic component, said electronics component having circuitry to control a process within said microfluidic component, and wherein said electronics component is formed of discrete electronic devices on a substrate that is bonded to said microfluidic component. - View Dependent Claims (24, 25, 26, 27, 28)
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Specification